Inventor · disambiguated record
Tetsuya Enomoto
Also filed as: ENOMOTO TETSUYA
29 granted patents·13 pending applications·366 citations·filing 1987–2025
96Inventor score
Files withDENSO CORP8HITACHI CHEMICAL CO LTD7SANYO ELECTRIC CO7HD MICROSYSTEMS LTD4HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD4
Top patents by PatentIndex Score
42 records- 0188US6747610B1Stereoscopic image display apparatus capable of selectively displaying desired stereoscopic imageSANYO ELECTRIC CO·Filed 1998·Granted Jun 8, 2004·124 cites·2 claims
- 0284US8034659B2Production method of semiconductor device and bonding filmHITACHI CHEMICAL CO LTD·Filed 2007·Granted Oct 11, 2011·12 cites·13 claims
- 0382US11487201B2Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic componentHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2018·Granted Nov 1, 2022·3 cites·14 claims
- 0482US2025362601A1Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic ComponentHD MICROSYSTEMS LTD·Filed 2025·Application pending·0 cites
- 0578US5739844AMethod of converting two-dimensional image into three-dimensional imageSANYO ELECTRIC CO·Filed 1995·Granted Apr 14, 1998·72 cites·8 claims
- 0675US7205645B2Wiring board, semiconductor device, and method of manufacturing wiring boardHITACHI CHEMICAL CO LTD·Filed 2001·Granted Apr 17, 2007·16 cites·20 claims
- 0771US7907232B2Liquid crystal display deviceHITACHI DISPLAYS LTD·Filed 2008·Granted Mar 15, 2011·3 cites·10 claims
- 0868US6553184B1Method of converting two dimensional images into three-dimensional imagesSANYO ELECTRIC CO·Filed 1998·Granted Apr 22, 2003·38 cites·13 claims
- 0967US10725379B2Polymide precursor resin compositionHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2013·Granted Jul 28, 2020·1 cites·10 claims
- 1066US12336434B2Piezoelectric film layered structure and method for producing thereofDENSO CORP·Filed 2021·Granted Jun 17, 2025·0 cites·5 claims
- 1164US9129898B2Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Granted Sep 8, 2015·1 cites·11 claims
- 1263US5825997AApparatus for producing a three dimensional image from a two dimensional imageSANYO ELECTRIC CO·Filed 1995·Granted Oct 20, 1998·29 cites·5 claims
- 1362US7704799B2Method of manufacturing wiring substrateHITACHI CHEMICAL CO LTD·Filed 2007·Granted Apr 27, 2010·1 cites·8 claims
- 1462US7488521B2Resinous tubeNISSAN MOTOR·Filed 2004·Granted Feb 10, 2009·7 cites·15 claims
- 1561US9024455B2Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor deviceHONDA KAZUTAKA·Filed 2010·Granted May 5, 2015·1 cites·7 claims
- 1660US12386257B2Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic componentHD MICROSYSTEMS LTD·Filed 2020·Granted Aug 12, 2025·0 cites·15 claims
- 1758US9431314B2Thermosetting resin composition for sealing packing of semiconductor, and semiconductor deviceENOMOTO TETSUYA·Filed 2011·Granted Aug 30, 2016·2 cites·7 claims
- 1857US9751984B2Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin compositionHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2013·Granted Sep 5, 2017·1 cites·13 claims
- 1954US9123734B2Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2014·Granted Sep 1, 2015·0 cites·11 claims
- 2054US2023201877A1Micro electro mechanical systems sensor and method for manufacturing the sameDENSO CORP·Filed 2023·Application pending·0 cites
- 2154US2023413675A1Piezoelectric film laminated body and manufacturing method of the sameDENSO CORP·Filed 2023·Application pending·0 cites
- 2252US6336210B1Panel-presentation-software creation method, computer-readable record medium recording a panel-presentation-software creation program, and panel-presentation-software creation deviceSANYO ELECTRIC CO·Filed 1999·Granted Jan 1, 2002·26 cites·15 claims
- 2352US2025253181A1Film for temporary fixing, laminate for temporary fixing, method for manufacturing semiconductor device, composition for temporary fixingRESONAC CORP·Filed 2023·Application pending·0 cites
- 2452US2023083830A1Piezoelectric film laminated body and manufacturing method of the sameDENSO CORP·Filed 2022·Application pending·0 cites
- 2550US2009008141A1Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofNAKAMURA HIDEHIRO·Filed 2008·Application pending·0 cites
- 2649US12294831B2Electroacoustic transducerDENSO CORP·Filed 2023·Granted May 6, 2025·0 cites·11 claims
- 2749US8028402B2Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2007·Granted Oct 4, 2011·0 cites·6 claims
- 2849US2008289868A1Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofNAKAMURA HIDEHIRO·Filed 2008·Application pending·0 cites
- 2948US7439991B1Image information presentation system, image information presentation method, medium storing image information presentation system program, and signal thereforSANYO ELECTRIC CO·Filed 1999·Granted Oct 21, 2008·21 cites·16 claims
- 3048US2025273502A1Film for temporary fixation, layered product for temporary fixation, and method for producing semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 3147US8674502B2Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor deviceHONDA KAZUTAKA·Filed 2010·Granted Mar 18, 2014·0 cites·15 claims
- 3247US6133683AColor cathode ray tube having an internal voltage dividerHITACHI LTD·Filed 1998·Granted Oct 17, 2000·8 cites·8 claims
- 3346US12294832B2Microelectromechanical systems deviceDENSO CORP·Filed 2022·Granted May 6, 2025·0 cites·7 claims
- 3445US11807721B2Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic componentHD MICROSYSTEMS LTD·Filed 2018·Granted Nov 7, 2023·0 cites·8 claims
- 3544US2019162949A1Mems deviceDENSO CORP·Filed 2019·Application pending·0 cites
- 3639US2003121560A1Resinous tubeFiled 2002·Application pending·0 cites
- 3737US2012105760A1Liquid crystal display deviceTORIYAMA YOSHIO·Filed 2011·Application pending·0 cites
- 3837US2019064509A1Variable focus mirror and optical scanning deviceDENSO CORP·Filed 2017·Application pending·0 cites
- 3936US12386256B2Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic componentHD MICROSYSTEMS LTD·Filed 2019·Granted Aug 12, 2025·0 cites·9 claims
- 4036US2011241228A1Epoxy resin composition for sealing packing of semiconductor, semiconductor device, and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2011·Application pending·0 cites
- 4134US11048167B2Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic componentHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2016·Granted Jun 29, 2021·0 cites·9 claims
- 4230US4894531APhotodetector for receiving an index signal of a beam-index cathode-ray tubeSANYO ELECTRIC CO·Filed 1987·Granted Jan 16, 1990·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →