Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

Abstract

The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

1 . A multi-layer wiring board obtainable by heating, pressing and laminating at a time at least two connection boards, wherein each of the connection boards is formed by a method comprising the steps of:
 selectively removing a first metallic layer of a composite metallic layer formed of, at least, a second metallic layer serving as a carrier and the first metallic layer, the first metallic layer having a different removal condition from the second metallic layer, to form a connection conductor;   forming an insulating resin composition layer, formed of at least one sub-layer, so as to cover at least side surfaces of the connection conductor;   polishing the insulating resin composition layer such that at least a side surface of the connection conductor is exposed; and   covering the exposed surface of the connection conductor with metal,   wherein the connection conductors of the connection boards are made into an alloy by solid phase metallic diffusion or melt bonding via the metal and are conductively connected with each other; and the connection boards are mechanically connected with each other by the insulating resin composition layer.   
   
   
       2 . The multi-layer wiring board according to  claim 1 , wherein at least one of the connection boards further comprises a conductor circuit which is electrically connected to the connection conductor for at least one surface of the connection board; and the conductor circuit is covered with metal. 
   
   
       3 . The multi-layer wiring board according to  claim 2 , wherein the conductor circuit is formed by selectively removing the second metallic layer after polishing the insulating resin composition layer so that the connection conductor is exposed. 
   
   
       4 . The multi-layer wiring board according to  claim 1 , wherein at least one of the connection boards is formed by a method further comprising the step of removing the second metallic layer so that a surface of the connection conductor is exposed, whereby surfaces of the connection conductor are exposed through both surfaces of the insulating resin composition layer in the thickness direction. 
   
   
       5 . The multi-layer wiring board according to  claim 4 , wherein the exposed surfaces of the connection conductor are covered with metal. 
   
   
       6 . The multi-layer wiring board according to  claim 1 , wherein at least one sub-layer of the insulating resin composition layer, placed at least one of front and rear outermost layers of the insulating resin composition layer, is mainly made of thermoplastic resin. 
   
   
       7 . The multi-layer wiring board according to  claim 1 , wherein at least one sub-layer of the insulating resin composition layer, which is at least one of a front surface layer and a rear surface layer of the insulating resin composition layer, contains a liquid crystal polymer. 
   
   
       8 . The multi-layer wiring board according to  claim 7 , wherein the liquid crystal polymer has a 180° C. or higher phase transition temperature from smectic phase to nematic phase. 
   
   
       9 . The multi-layer wiring board according to  claim 7 , wherein the liquid crystal polymer has a 280° C. or higher phase transition temperature from smectic phase to nematic phase. 
   
   
       10 . The multi-layer wiring board according to  claim 1 , wherein said insulating resin composition layer includes at least two sub-layers. 
   
   
       11 . The multi-layer wiring board according to  claim 1 , wherein the connection conductor is covered with one or more selected from the group consisting of copper, indium, zinc, lead, gold, platinum, nickel, palladium, tin, and alloys thereof. 
   
   
       12 . The multi-layer wiring board according to  claim 1 , wherein the connection conductor is covered with a metallic film formed by a method of performing electroless copper plating subsequent to application of palladium, copper sputtering or copper sputtering with chromium being a base, a printing of silver paste, substituted or electroless gold plating, electrolysis or electroless plating of nickel/gold, electrolysis or electroless plating of nickel/palladium/gold, or electrolysis or electroless plating of tin or tin alloy. 
   
   
       13 . The multi-layer wiring board according to  claim 6 , wherein the thermoplastic resin has a modulus of elasticity that is equal to or larger than 0.0001 GPa at a heating temperature.