Inventor · disambiguated record
Shigeharu Arike
Also filed as: ARIKE SHIGEHARU
17 granted patents·6 pending applications·455 citations·filing 1991–2010
95Inventor score
Top patents by PatentIndex Score
23 records- 0191US6042685AMultiple wire printed circuit board and process for making the sameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Mar 28, 2000·66 cites·12 claims
- 0289US5879568AProcess for producing multilayer printed circuit board for wire bondingHITACHI LTD·Filed 1997·Granted Mar 9, 1999·126 cites·8 claims
- 0383US8426742B2Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor packageEJIRI YOSHINORI·Filed 2008·Granted Apr 23, 2013·14 cites·16 claims
- 0482US5690837AProcess for producing multilayer printed circuit boardHITACHI CHEMICAL CO LTD·Filed 1995·Granted Nov 25, 1997·55 cites·13 claims
- 0580US5562971AMultilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 1995·Granted Oct 8, 1996·58 cites·9 claims
- 0665US5688408AMultilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 1996·Granted Nov 18, 1997·29 cites·30 claims
- 0763US8889084B2Micro fluid system support and manufacturing method thereofKAWAZOE HIROSHI·Filed 2009·Granted Nov 18, 2014·0 cites·29 claims
- 0860US8865090B2Micro fluid system support and manufacturing method thereofKAWAZOE HIROSHI·Filed 2009·Granted Oct 21, 2014·0 cites·10 claims
- 0960US5403869AAdhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiatorHITACHI CHEMICAL CO LTD·Filed 1993·Granted Apr 4, 1995·17 cites·3 claims
- 1060US2009274586A1Micro fluid system support and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2009·Application pending·0 cites
- 1159US8809696B2Method for surface treatment of copper and copperYAMASHITA TOMOAKI·Filed 2009·Granted Aug 19, 2014·4 cites·20 claims
- 1259US5584121AProcess for producing multiple wire wiring boardHITACHI CHEMICAL CO LTD·Filed 1995·Granted Dec 17, 1996·12 cites·5 claims
- 1358US5486655AMultiple wire adhesive on a multiple wire wiring boardHITACHI CHEMICAL CO LTD·Filed 1994·Granted Jan 23, 1996·16 cites·2 claims
- 1455US5233133ACoaxial conductor interconnection wiring boardHITACHI CHEMICAL CO LTD·Filed 1991·Granted Aug 3, 1993·17 cites·2 claims
- 1555US2011036479A1Micro fluid system support and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2010·Application pending·0 cites
- 1654US5323534AProcess for producing coaxial conductor interconnection wiring boardHITACHI CHEMICAL CO LTD·Filed 1993·Granted Jun 28, 1994·17 cites·6 claims
- 1753US6197149B1Production of insulating varnishes and multilayer printed circuit boards using these varnishesHITACHI CHEMICAL CO LTD·Filed 1998·Granted Mar 6, 2001·15 cites·13 claims
- 1851US2005249637A1Micro fluid system support and manufacturing method thereofKAWAZOE HIROSHI·Filed 2003·Application pending·0 cites
- 1950US2009008141A1Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofNAKAMURA HIDEHIRO·Filed 2008·Application pending·0 cites
- 2049US8028402B2Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2007·Granted Oct 4, 2011·0 cites·6 claims
- 2149US2008289868A1Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofNAKAMURA HIDEHIRO·Filed 2008·Application pending·0 cites
- 2244US5928757AMultiple wire printed circuit board and process for making the sameHITACHI CHEMICAL CO LTD·Filed 1996·Granted Jul 27, 1999·9 cites·9 claims
- 2336US2006162956A1Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing themNAKAMURA HIDEHIRO·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →