Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

Abstract

The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

1 . A connection board comprising an insulating resin composition layer formed of at least one sub-layer and a connection conductor which is formed so as to pass through the insulating resin composition layer in its thickness direction at least at a position where a conductor circuit is connected, wherein the connection conductor includes at least two metal layers. 
   
   
       2 . The connection board according to  claim 1 , further comprising a conductor circuit which is electrically connected to the connection conductor for at least one surface of the connection board. 
   
   
       3 . The connection board according to  claim 2 , wherein the conductor circuit is a metallic layer. 
   
   
       4 . The connection board according to  claim 1 , wherein an exposed portion of the connection conductor is covered with metal. 
   
   
       5 . The connection board according to  claim 1 , wherein at least one sub-layer of the insulating resin composition layer, placed at at least one of front and rear outermost layers of the insulating resin composition layer, is mainly made of thermoplastic resin. 
   
   
       6 . The connection board according to  claim 2 , wherein an exposed portion of the connection conductor is covered with metal. 
   
   
       7 . The connection board according to  claim 2 , wherein at least one sub-layer of the insulating resin composition layer, placed at at least one of front and rear outermost layers of the insulating resin composition layer, is mainly made of thermoplastic resin. 
   
   
       8 . The connection board according to  claim 3 , wherein an exposed portion of the connection conductor is covered with metal. 
   
   
       9 . The connection board according to  claim 3 , wherein at least one sub-layer of the insulating resin composition layer, placed at at least one of front and rear outermost layers of the insulating resin composition layer, is mainly made of thermoplastic resin. 
   
   
       10 . A multi-layer wiring board in which connection conductors, or a connection conductor and conductor circuit, of at least two connection boards, obtained by being arbitrarily selected from connection boards according to  claim 1 , are made into an alloy by solid phase metallic diffusion or melt bonding and conductively connected with each other, and the connection boards are mechanically connected with each other by an insulating resin composition. 
   
   
       11 . The multi-layer wiring board according to  claim 10 , wherein an insulating resin composition layer of at least one of the at least two connection boards is a liquid crystal polymer. 
   
   
       12 . A substrate for semiconductor package having the multi-layer wiring board according to  claim 10 . 
   
   
       13 . The substrate for semiconductor package according to  claim 12 , comprising a cavity at a position where a semiconductor chip is mounted. 
   
   
       14 . A semiconductor package manufactured by using the substrate for semiconductor package according to  claim 12 . 
   
   
       15 . A semiconductor package manufactured by using the substrate for semiconductor package according to  claim 13 . 
   
   
       16 . A multi-layer wiring board in which connection conductors, or a connection conductor and conductor circuit, of at least two connection boards, obtained by being arbitrarily selected from connection boards according to  claim 2 , are made into an alloy by solid phase metallic diffusion or melt bonding arid conductively connected with each other, and the connection boards are mechanically connected with each other by an insulating resin composition. 
   
   
       17 . The multi-layer wiring board according to  claim 16 , wherein an insulating resin composition layer of at least one of the at least two connection boards is a liquid crystal polymer. 
   
   
       18 . A substrate for semiconductor package having the multi-layer wiring board according to  claim 16 . 
   
   
       19 . The substrate for semiconductor package according to  claim 18 , comprising a cavity at a position where a semiconductor chip is mounted. 
   
   
       20 . A semiconductor package manufactured by using the substrate for semiconductor package according to  claim 18 .