Inventor · disambiguated record
Akishi Nakaso
Also filed as: NAKASO AKISHI · OKAMURA TOSHIRO
27 granted patents·6 pending applications·1,084 citations·filing 1978–2010
97Inventor score
Top patents by PatentIndex Score
33 records- 0194US4902551AProcess for treating copper surfaceHITACHI CHEMICAL CO LTD·Filed 1988·Granted Feb 20, 1990·109 cites·14 claims
- 0293US6281450B1Substrate for mounting semiconductor chipsHITACHI CHEMICAL CO LTD·Filed 1998·Granted Aug 28, 2001·206 cites·9 claims
- 0389US5879568AProcess for producing multilayer printed circuit board for wire bondingHITACHI LTD·Filed 1997·Granted Mar 9, 1999·126 cites·8 claims
- 0488US5965245APrepreg for printed circuit boardHITACHI CHEMICAL CO LTD·Filed 1996·Granted Oct 12, 1999·66 cites·35 claims
- 0586US5309632AProcess for producing printed wiring boardHITACHI CHEMICAL CO LTD·Filed 1992·Granted May 10, 1994·66 cites·9 claims
- 0686US4216246AMethod of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boardsHITACHI CHEMICAL CO LTD·Filed 1978·Granted Aug 5, 1980·48 cites·6 claims
- 0784US7588835B2Method of treating the surface of copper and copperHITACHI CHEMICAL CO LTD·Filed 2006·Granted Sep 15, 2009·14 cites·18 claims
- 0884US5689879AMetal foil for printed wiring board and production thereofHITACHI CHEMICAL CO LTD·Filed 1994·Granted Nov 25, 1997·46 cites·19 claims
- 0982US5690837AProcess for producing multilayer printed circuit boardHITACHI CHEMICAL CO LTD·Filed 1995·Granted Nov 25, 1997·55 cites·13 claims
- 1080US6207266B1Electromagnetically shielding bonding filmHITACHI CHEMICAL CO LTD·Filed 1997·Granted Mar 27, 2001·44 cites·52 claims
- 1180US6184577B1Electronic component parts deviceHITACHI CHEMICAL CO LTD·Filed 1997·Granted Feb 6, 2001·62 cites·8 claims
- 1279US5403672AMetal foil for printed wiring board and production thereofHITACHI CHEMICAL CO LTD·Filed 1993·Granted Apr 4, 1995·33 cites·10 claims
- 1374US5638598AProcess for producing a printed wiring boardHITACHI CHEMICAL CO LTD·Filed 1995·Granted Jun 17, 1997·38 cites·26 claims
- 1469US4643793AProcess for treating metal surfaceHITACHI CHEMICAL CO LTD·Filed 1985·Granted Feb 17, 1987·29 cites·10 claims
- 1567US4548644AElectroless copper deposition solutionHITACHI CHEMICAL CO LTD·Filed 1983·Granted Oct 22, 1985·20 cites·12 claims
- 1663US8889084B2Micro fluid system support and manufacturing method thereofKAWAZOE HIROSHI·Filed 2009·Granted Nov 18, 2014·0 cites·29 claims
- 1760US8865090B2Micro fluid system support and manufacturing method thereofKAWAZOE HIROSHI·Filed 2009·Granted Oct 21, 2014·0 cites·10 claims
- 1860US2009274586A1Micro fluid system support and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2009·Application pending·0 cites
- 1957US5444189APrinted wiring board and production thereofHITACHI CHEMICAL CO LTD·Filed 1993·Granted Aug 22, 1995·19 cites·9 claims
- 2056US6153359AProcess for producing multilayer printed circuit boardsHITACHI CHEMICAL CO LTD·Filed 1999·Granted Nov 28, 2000·19 cites·11 claims
- 2155US5206052AElectroless plating processHITACHI CHEMICAL CO LTD·Filed 1990·Granted Apr 27, 1993·18 cites·12 claims
- 2255US2011036479A1Micro fluid system support and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2010·Application pending·0 cites
- 2353US6197149B1Production of insulating varnishes and multilayer printed circuit boards using these varnishesHITACHI CHEMICAL CO LTD·Filed 1998·Granted Mar 6, 2001·15 cites·13 claims
- 2453US5736065AChemical reducing solution for copper oxideHITACHI CHEMICAL CO LTD·Filed 1997·Granted Apr 7, 1998·15 cites·5 claims
- 2552US4557762AElectroless copper plating solutionHITACHI CHEMICAL CO LTD·Filed 1984·Granted Dec 10, 1985·12 cites·8 claims
- 2651US2005249637A1Micro fluid system support and manufacturing method thereofKAWAZOE HIROSHI·Filed 2003·Application pending·0 cites
- 2750US2009008141A1Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofNAKAMURA HIDEHIRO·Filed 2008·Application pending·0 cites
- 2849US8028402B2Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2007·Granted Oct 4, 2011·0 cites·6 claims
- 2949US2008289868A1Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofNAKAMURA HIDEHIRO·Filed 2008·Application pending·0 cites
- 3042US5945258AProcess for producing multilayer printed circuit boardsHITACHI CHEMICAL CO LTD·Filed 1996·Granted Aug 31, 1999·10 cites·5 claims
- 3137US5254156AAqueous solution for activation accelerating treatmentHITACHI CHEMICAL CO LTD·Filed 1992·Granted Oct 19, 1993·7 cites·3 claims
- 3236US5243144AWiring board and process for producing the sameHITACHI CHEMICAL CO LTD·Filed 1989·Granted Sep 7, 1993·7 cites·2 claims
- 3336US2006162956A1Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing themNAKAMURA HIDEHIRO·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →