Inventor · disambiguated record
Kousuke Hiroki
Also filed as: HIROKI KOUSUKE
2 granted patents·3 pending applications·0 citations·filing 2002–2017
27Inventor score
Top patents by PatentIndex Score
5 records- 0150US2009008141A1Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofNAKAMURA HIDEHIRO·Filed 2008·Application pending·0 cites
- 0249US8028402B2Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2007·Granted Oct 4, 2011·0 cites·6 claims
- 0349US2008289868A1Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofNAKAMURA HIDEHIRO·Filed 2008·Application pending·0 cites
- 0437US11320430B2Magnetic particle dispersionJSR CORP·Filed 2017·Granted May 3, 2022·0 cites·5 claims
- 0536US2006162956A1Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing themNAKAMURA HIDEHIRO·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →