Assignee
NAKAMURA HIDEHIRO
JP·2 granted patents·3 pending applications·18 citations·filing 2002–2010
Top patents by PatentIndex Score
5 records- 0186US8648605B2Sensor, sensor system, portable sensor system, method of analyzing metal ions, mounting substrate, method of analyzing plating preventing chemical species, method of analyzing produced compound, and method of analyzing monovalent copper chemical speciesNAKAMURA HIDEHIRO·Filed 2008·Granted Feb 11, 2014·14 cites·37 claims
- 0280US8535623B2Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interprolated cylinderNAKAMURA HIDEHIRO·Filed 2010·Granted Sep 17, 2013·4 cites·16 claims
- 0350US2009008141A1Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofNAKAMURA HIDEHIRO·Filed 2008·Application pending·0 cites
- 0449US2008289868A1Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofNAKAMURA HIDEHIRO·Filed 2008·Application pending·0 cites
- 0536US2006162956A1Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing themNAKAMURA HIDEHIRO·Filed 2002·Application pending·0 cites
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