Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device

Abstract

A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.

What is claimed is: 
     
       1. A semiconductor device comprising:
 (1) at least one semiconductor chip; 
 (2) a board, wherein the at least one semiconductor chip is connected to the board; and 
 (3) a semiconductor encapsulation adhesive composition that-comprising
 (a) an epoxy resin, 
 (b) a curing agent, 
 (c) an antioxidant, wherein the antioxidant is a hindered phenol, and 
 (d) a high molecular component with a weight-average molecular weight of 10,000 or greater 
 
 wherein gaps between the semiconductor chips and the board are underfilled with the semiconductor encapsulation adhesive composition. 
 
     
     
       2. The semiconductor device according to  claim 1 , wherein the high molecular component with a weight-average molecular weight of 10,000 or greater comprises at least one component selected from a group consisting of phenoxy resin, polyimide resin, polyamide resin, polycarbodiimide resin, phenol resin, cyanate ester resin, acrylic resin, polyester resin, polyethylene resin, polyethersulfone resin, polyetherimide resin, polyvinylacetal resin, urethane resin, acrylic rubber or copolymers of two or more different types thereof. 
     
     
       3. The semiconductor device according to  claim 1 , wherein the high molecular component comprises polyimide resin. 
     
     
       4. The semiconductor device according to  claim 3 , wherein the polyimide resin has a weight-average molecular weight of 30,000 or greater and a glass transition temperature of no higher than 100° C. 
     
     
       5. The semiconductor device according to  claim 4 , wherein the curing agent is a phenol compound. 
     
     
       6. A method for producing a semiconductor device, the method comprising the steps of:
 (1) connecting semiconductor chips to a board using a semiconductor encapsulation adhesive composition; and 
 (2) underfilling the gaps between the semiconductor chips and the board using the semiconductor encapsulation adhesive composition, 
 wherein the semiconductor encapsulation adhesive composition comprises (a) an epoxy resin, (b) a curing agent, (c) an antioxidant, wherein the antioxidant is a hindered phenol, and (d) a high molecular component with a weight-average molecular weight of 10,000 or greater. 
 
     
     
       7. The method according to  claim 6 , wherein the high molecular component with a weight-average molecular weight of 10,000 or greater comprises at least one component selected from a group consisting of phenoxy resin, polyimide resin, polyamide resin, polycarbodiimide resin, phenol resin, cyanate ester resin, acrylic resin, polyester resin, polyethylene resin, polyethersulfone resin, polyetherimide resin, polyvinylacetal resin, urethane resin, acrylic rubber or copolymers of two or more different types thereof. 
     
     
       8. The method according to  claim 6 , wherein the high molecular component comprises polyimide resin. 
     
     
       9. The method according to  claim 8 , wherein the polyimide resin has a weight-average molecular weight of 30,000 or greater and a glass transition temperature of no higher than 100° C. 
     
     
       10. The method according to  6 , wherein the curing agent is a phenol compound. 
     
     
       11. A semiconductor device, where the semiconductor device is produced by the method according to  claim 6 .