Assignee
HO CHUNG W
TW·7 granted patents·7 pending applications·7 citations·filing 2008–2024
Top patents by PatentIndex Score
14 records- 0183US11189501B1Chip package structure and manufacturing method thereofHO CHUNG W·Filed 2021·Granted Nov 30, 2021·1 cites·15 claims
- 0279US10201099B1Manufacturing method of circuit substrate including electronic deviceHO CHUNG W·Filed 2018·Granted Feb 5, 2019·3 cites·18 claims
- 0371US9137899B2Process of electronic structure and electronic structureHO CHUNG W·Filed 2012·Granted Sep 15, 2015·3 cites·25 claims
- 0463US2025226325A1Package structure and manufacturing method thereofHO CHUNG W·Filed 2024·Application pending·0 cites
- 0563US2026018528A1Package structure and manufacturing method thereofHO CHUNG W·Filed 2024·Application pending·0 cites
- 0662US2025226329A1Chip package structure and manufacturing method thereofHO CHUNG W·Filed 2024·Application pending·0 cites
- 0760US2024250012A1Package carrier and manufacturing method thereof and chip package structureHO CHUNG W·Filed 2024·Application pending·0 cites
- 0860US2024243021A1Package carrier and manufacturing method thereof and chip package structureHO CHUNG W·Filed 2024·Application pending·0 cites
- 0958US11227824B1Chip carrier and manufacturing method thereofHO CHUNG W·Filed 2021·Granted Jan 18, 2022·0 cites·23 claims
- 1055US11178774B1Method for manufacturing circuit boardHO CHUNG W·Filed 2021·Granted Nov 16, 2021·0 cites·12 claims
- 1154US11217551B1Chip package structure and manufacturing method thereofHO CHUNG W·Filed 2021·Granted Jan 4, 2022·0 cites·13 claims
- 1248US2008257590A1High thermal conducting circuit substrate and manufacturing process thereofHO CHUNG W·Filed 2008·Application pending·0 cites
- 1341US2013319620A1Board separation apparatus and operating method thereofHO CHUNG W·Filed 2012·Application pending·0 cites
- 1439US8939188B2Edge separation equipment and operating method thereofHO CHUNG W·Filed 2012·Granted Jan 27, 2015·0 cites·10 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →