Assignee
HUEMOELLER RONALD PATRICK
US·14 granted patents·196 citations·filing 2007–2012
Top patents by PatentIndex Score
14 records- 0197US8432022B1Shielded embedded electronic component substrate fabrication method and structureHUEMOELLER RONALD PATRICK·Filed 2009·Granted Apr 30, 2013·65 cites·16 claims
- 0296US8298866B1Wafer level package and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2012·Granted Oct 30, 2012·16 cites·20 claims
- 0396US8119455B1Wafer level package fabrication methodHUEMOELLER RONALD PATRICK·Filed 2011·Granted Feb 21, 2012·15 cites·19 claims
- 0494US8486764B1Wafer level package and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2012·Granted Jul 16, 2013·9 cites·20 claims
- 0593US9048298B1Backside warpage control structure and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2012·Granted Jun 2, 2015·15 cites·20 claims
- 0692US8324511B1Through via nub reveal method and structureHUEMOELLER RONALD PATRICK·Filed 2010·Granted Dec 4, 2012·15 cites·16 claims
- 0790US8322030B1Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patternsHUEMOELLER RONALD PATRICK·Filed 2007·Granted Dec 4, 2012·11 cites·33 claims
- 0889US9129943B1Embedded component package and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2012·Granted Sep 8, 2015·9 cites·20 claims
- 0987US8390116B1Flip chip bump structure and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2011·Granted Mar 5, 2013·7 cites·18 claims
- 1086US8316536B1Multi-level circuit substrate fabrication methodHUEMOELLER RONALD PATRICK·Filed 2008·Granted Nov 27, 2012·8 cites·20 claims
- 1185US8323771B1Straight conductor blind via capture pad structure and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2007·Granted Dec 4, 2012·13 cites·11 claims
- 1285US8263486B1Bumped chip package fabrication method and structureHUEMOELLER RONALD PATRICK·Filed 2011·Granted Sep 11, 2012·7 cites·20 claims
- 1381US8426966B1Bumped chip packageHUEMOELLER RONALD PATRICK·Filed 2012·Granted Apr 23, 2013·5 cites·20 claims
- 1467US9060430B1Shielded trace structure and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2010·Granted Jun 16, 2015·1 cites·20 claims
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