Assignee
IWASA SEIICHI
JP·1 granted patent·2 pending applications·0 citations·filing 2005–2011
Top patents by PatentIndex Score
3 records- 0144US8062947B2Semiconductor device and method of manufacturing the sameIWASA SEIICHI·Filed 2008·Granted Nov 22, 2011·0 cites·8 claims
- 0239US2011316056A1Semiconductor device and method of manufacturing the sameIWASA SEIICHI·Filed 2011·Application pending·0 cites
- 0332US2006086959A1Semiconductor deviceIWASA SEIICHI·Filed 2005·Application pending·0 cites
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