Assignee
JIN YONGGANG
SG·5 granted patents·2 pending applications·119 citations·filing 2008–2012
Top patents by PatentIndex Score
7 records- 0197US8664044B2Method of fabricating land grid array semiconductor packageJIN YONGGANG·Filed 2011·Granted Mar 4, 2014·97 cites·13 claims
- 0282US9013037B2Semiconductor package with improved pillar bump process and structureJIN YONGGANG·Filed 2011·Granted Apr 21, 2015·7 cites·13 claims
- 0382US8119454B2Manufacturing fan-out wafer level packagingJIN YONGGANG·Filed 2008·Granted Feb 21, 2012·10 cites·11 claims
- 0468US9012269B2Reducing warpage for fan-out wafer level packagingJIN YONGGANG·Filed 2012·Granted Apr 21, 2015·3 cites·11 claims
- 0566US8937008B2Apparatus and method for placing solder ballsJIN YONGGANG·Filed 2011·Granted Jan 20, 2015·2 cites·15 claims
- 0646US2012038043A1Manufacturing fan-out wafer level packagingJIN YONGGANG·Filed 2011·Application pending·0 cites
- 0735US2012282767A1Method for producing a two-sided fan-out wafer level package with electrically conductive interconnects, and a corresponding semiconductor packageJIN YONGGANG·Filed 2011·Application pending·0 cites
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