Assignee
KANEKO KENTARO
JP·12 granted patents·3 pending applications·80 citations·filing 2007–2012
Top patents by PatentIndex Score
15 records- 0193US9210808B2Wiring substrate and method of manufacturing the sameKANEKO KENTARO·Filed 2012·Granted Dec 8, 2015·17 cites·18 claims
- 0292US8797757B2Wiring substrate and manufacturing method thereofKANEKO KENTARO·Filed 2012·Granted Aug 5, 2014·16 cites·5 claims
- 0389US8067695B2Wiring board and method of manufacturing the sameKANEKO KENTARO·Filed 2009·Granted Nov 29, 2011·18 cites·6 claims
- 0485US8225502B2Wiring board manufacturing methodKANEKO KENTARO·Filed 2008·Granted Jul 24, 2012·13 cites·15 claims
- 0578US8754336B2Wiring board and method of producing the sameKANEKO KENTARO·Filed 2012·Granted Jun 17, 2014·4 cites·15 claims
- 0673US8183467B2Wiring board and method of producing the sameKANEKO KENTARO·Filed 2009·Granted May 22, 2012·4 cites·18 claims
- 0771US9236334B2Wiring substrate and method for manufacturing wiring substratesKANEKO KENTARO·Filed 2012·Granted Jan 12, 2016·4 cites·8 claims
- 0866US8476536B2Wiring substrate and method for manufacturing the sameKANEKO KENTARO·Filed 2007·Granted Jul 2, 2013·2 cites·21 claims
- 0960US8610287B2Wiring substrate and method of manufacturing the sameKANEKO KENTARO·Filed 2010·Granted Dec 17, 2013·1 cites·8 claims
- 1055US2012256320A1Wiring board manufacturing method, semiconductor device manufacturing method and wiring boardKANEKO KENTARO·Filed 2012·Application pending·0 cites
- 1153US8502398B2Wiring board, semiconductor apparatus and method of manufacturing themKANEKO KENTARO·Filed 2008·Granted Aug 6, 2013·0 cites·11 claims
- 1251US8779602B2Wiring board, semiconductor apparatus and method of manufacturing themKANEKO KENTARO·Filed 2012·Granted Jul 15, 2014·0 cites·12 claims
- 1351US8338718B2Wiring board and method of manufacturing the sameKANEKO KENTARO·Filed 2009·Granted Dec 25, 2012·1 cites·10 claims
- 1444US2011290536A1Wiring substrateKANEKO KENTARO·Filed 2011·Application pending·0 cites
- 1539US2012006591A1Wiring Substrate and Method for Manufacturing Wiring SubstrateKANEKO KENTARO·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →