Assignee
KANG JOON SEOK
KR·4 granted patents·3 pending applications·11 citations·filing 2008–2012
Top patents by PatentIndex Score
7 records- 0171US8283768B2Wafer Level package for heat dissipation and method of manufacturing the sameKANG JOON SEOK·Filed 2009·Granted Oct 9, 2012·4 cites·6 claims
- 0270US8110914B2Wafer level package with removable chip protecting layerKANG JOON SEOK·Filed 2009·Granted Feb 7, 2012·4 cites·4 claims
- 0367US8334602B2Die package including encapsulated die and method of manufacturing the sameKANG JOON SEOK·Filed 2009·Granted Dec 18, 2012·3 cites·3 claims
- 0447US8779580B2Electronic component package and manufacturing method thereofKANG JOON-SEOK·Filed 2008·Granted Jul 15, 2014·0 cites·5 claims
- 0547US2012295404A1Method of manufacturing semiconductor packageKANG JOON SEOK·Filed 2012·Application pending·0 cites
- 0646US2012129297A1Method of manufacturing wafer level packageKANG JOON SEOK·Filed 2012·Application pending·0 cites
- 0736US2013139753A1Apparatus for manufacturing substrateKANG JOON SEOK·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →