Assignee
KIKKAWA TOSHIHIDE
JP·8 granted patents·1 pending application·21 citations·filing 2009–2012
Top patents by PatentIndex Score
9 records- 0189US8294181B2Compound semiconductor device and method of manufacturing the sameKIKKAWA TOSHIHIDE·Filed 2010·Granted Oct 23, 2012·10 cites·12 claims
- 0276US8183572B2Compound semiconductor device and its manufacture methodKIKKAWA TOSHIHIDE·Filed 2009·Granted May 22, 2012·5 cites·8 claims
- 0375US8507329B2Compound semiconductor device and method of manufacturing the sameKIKKAWA TOSHIHIDE·Filed 2012·Granted Aug 13, 2013·3 cites·7 claims
- 0468US8603871B2Compound semiconductor device and its manufacture methodKIKKAWA TOSHIHIDE·Filed 2012·Granted Dec 10, 2013·2 cites·10 claims
- 0566US8193539B2Compound semiconductor device using SiC substrate and its manufactureKIKKAWA TOSHIHIDE·Filed 2010·Granted Jun 5, 2012·1 cites·19 claims
- 0653US8658482B2Compound semiconductor device and method for fabricating the sameKIKKAWA TOSHIHIDE·Filed 2010·Granted Feb 25, 2014·0 cites·7 claims
- 0751US8637903B2Compound semiconductor device and manufacturing method of the sameKIKKAWA TOSHIHIDE·Filed 2011·Granted Jan 28, 2014·0 cites·6 claims
- 0851US8466029B2Compound semiconductor device and manufacturing method of the sameKIKKAWA TOSHIHIDE·Filed 2011·Granted Jun 18, 2013·0 cites·7 claims
- 0948US2011297957A1Compound seminconductor structureKIKKAWA TOSHIHIDE·Filed 2011·Application pending·0 cites
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