Assignee
KIMURA JUNICHI
JP·1 granted patent·1 pending application·0 citations·filing 2007–2011
Top patents by PatentIndex Score
2 records- 0142US2008073024A1Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatusKIMURA JUNICHI·Filed 2007·Application pending·0 cites
- 0238US8217515B2Semiconductor mounting substrate and method for manufacturing the sameKIMURA JUNICHI·Filed 2011·Granted Jul 10, 2012·0 cites·11 claims
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