Assignee
KOTANI TAKAHIRO
JP·1 granted patent·2 pending applications·2 citations·filing 2005–2012
Top patents by PatentIndex Score
3 records- 0160US8324326B2Epoxy resin composition and semiconductor deviceKOTANI TAKAHIRO·Filed 2008·Granted Dec 4, 2012·2 cites·7 claims
- 0242US2006157872A1Epoxy resin composition and semiconductor deviceKOTANI TAKAHIRO·Filed 2005·Application pending·0 cites
- 0334US2013337608A1Semiconductor device, and process for manufacturing semiconductor deviceKOTANI TAKAHIRO·Filed 2012·Application pending·0 cites
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