Assignee
KOYAMA NAOYUKI
JP·1 granted patent·1 pending application·13 citations·filing 2004–2007
Top patents by PatentIndex Score
2 records- 0165US8075800B2Polishing slurry and polishing methodKOYAMA NAOYUKI·Filed 2004·Granted Dec 13, 2011·13 cites·15 claims
- 0247US2007169421A1CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasiveKOYAMA NAOYUKI·Filed 2007·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →