Assignee
LEE SEON GOO
KR·7 granted patents·1 pending application·514 citations·filing 2006–2011
Top patents by PatentIndex Score
8 records- 0198US8324646B2Chip coated light emitting diode package and manufacturing method thereofLEE SEON GOO·Filed 2010·Granted Dec 4, 2012·479 cites·25 claims
- 0294US8105854B2LED packageLEE SEON GOO·Filed 2009·Granted Jan 31, 2012·28 cites·5 claims
- 0374US8202746B2Method of manufacturing LED package for formation of molding memberLEE SEON GOO·Filed 2008·Granted Jun 19, 2012·7 cites·5 claims
- 0454USRE43200EHigh power light emitting diode packageLEE SEON GOO·Filed 2008·Granted Feb 21, 2012·0 cites·33 claims
- 0553USRE44811EHigh power light emitting diode packageLEE SEON GOO·Filed 2011·Granted Mar 18, 2014·0 cites·36 claims
- 0647USRE45596EHigh power light emitting diode packageLEE SEON GOO·Filed 2011·Granted Jun 30, 2015·0 cites·30 claims
- 0743US8169128B2LED package having recess in heat conducting partLEE SEON GOO·Filed 2006·Granted May 1, 2012·0 cites·24 claims
- 0843US2008179616A1LED packageLEE SEON GOO·Filed 2008·Application pending·0 cites
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