High power light emitting diode package

Abstract

The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

What is claimed is: 
     
       1. A high power Light Emitting Diode (LED) package mounted on a board, which includes a metal plate of a heat sink, an insulating layer on the metal plate and a conductive pattern printed with plural pattern lines on the insulating layer, the high power LED package, comprising:
 an LED chip; 
 a package body integrally formed with resin to have a recess for receiving the LED chip; 
 a first sheet metal member electrically connected with the LED chip while having an upper partial portion supporting the LED chip at its upper partial portion in the recess, the first sheet metal member being surrounded by the package body and extending to the a side face of the package body to be exposed to an outside of the package body, the first sheet metal member having a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the an inside of the package body so that a lower end thereof of the section is exposed at a bottom face of the package body thus to contact the board, such that the first sheet metal member is formed as a single body; 
 a second sheet metal member electrically connected with the LED chip and spaced apart from the first sheet metal member for by a predetermined gap, the second sheet metal member extending through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member; and 
 a transparent sealant sealingly filled up into in the recess; 
 wherein 
 the second sheet metal member is divided into a pair of first and second terminals insulated from each other, and 
 the first terminal and the second terminal are connected with electrodes of the LED chip, respectively. 
 
     
     
       2. The high power LED package according to  claim 1 , wherein the heat transfer section of the first sheet metal member is protruded downward from the bottom face of the package body. 
     
     
       3. The high power LED package according to  claim 1 , wherein the first and second sheet metal members each have at least one hole, and the package body has a plurality of connecting posts that are integrally formed and connected with the upper and lower portions of the package body through the holes. 
     
     
       4. The high power LED package according to  claim 1 , wherein the first sheet metal member is contacted with one electrode of the LED chip, and further has an external terminal integrally formed therewith to extend over the outside of the package body thereby contacting one pattern line of the board, and wherein the second sheet metal member is connected at one end of the recess-side with the other electrode of the LED chip and extended at the other end of the recess-side out of the package body, thereby contacting the other pattern line of the board. 
     
     
       5. The high power LED package according to  claim 1 , wherein the second sheet metal member is divided into a pair of first and second terminals insulated from each other, in which
 the first terminal is connected at one end with one electrode of the LED chip and extended at the other end out of the package body, thereby for contacting one pattern line of the a board, and wherein 
 the second terminal is connected at one end with the other electrode of the LED chip and extended at the other end over the outside of the package body, thereby being for contacting the other another pattern line of the board. 
 
     
     
       6. The high power LED package according to  claim 1 , wherein the heat transfer section of the first sheet metal member has a T-shaped cross section and extends downwardly. 
     
     
       7. The high power LED package according to  claim 1 , wherein the heat transfer lower end of the section of the first sheet metal member is formed such that its lower end, on a side facing the second sheet metal member is cut at a, has a cut portion slant away from the second sheet metal member and the cut portion of the heat transfer section is covered with the package body. 
     
     
       8. The high power LED package according to  claim 1 , wherein the second sheet metal member has a structure symmetrical to the first sheet metal member. 
     
     
       9. The high power LED package according to  claim 8 , wherein the first and second sheet metal members are connected at their lower portion with pattern lines of the board. 
     
     
       10. The high power LED package according to  claim 1 , further comprising a high reflectivity reflective layer coated on the inner surface of the recess. 
     
     
       11. The high power LED package according to  claim 1 , further comprising a lens assembled onto the upper surface of the package body, and wherein the package body has a step at its upper edge so as to be engaged with the lower portion of the lens. 
     
     
       12. A high power Light Emitting Diode (LED) package mounted on a board, which includes a metal plate of a heat sink, an insulating layer on the metal plate and a conductive pattern printed with plural pattern lines on the insulating layer, the high power LED package comprising:
 an LED chip;   a package body integrally formed with resin to have a recess for receiving the LED chip;   a half T-shaped first sheet metal member electrically connected with the LED chip while supporting the LED chip at its upper partial portion in the recess, the first sheet metal member surrounded by the package body and extending to the side face of the package body, wherein the first sheet metal member has an upper section electrically connected at one end with the LED chip and a lower section overlapped on the lower portion of the upper section, the bottom surface of the lower section being exposed through the bottom face of the package body to contact the board;   a second sheet metal member electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, the second sheet metal member extending through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member; and   a transparent sealant sealingly filled up into the recess.   
     
     
       13. The high power LED package according to  claim 12 , wherein the upper and lower sections of the first sheet metal member are bonded together with conductive epoxy with high thermal and electric conductivities. 
     
     
       14. The high power LED package according to  claim 12 , wherein the first sheet metal member is folded up at the other end that is exposed through the package body side so that the upper and lower sections thereof are overlapped vertically on each other. 
     
     
       15. The high power LED package according to  claim 12 , wherein the other ends of the first and second sheet metal members are protruded from a sidewall of the package body. 
     
     
       16. The high power LED package according to  claim 12 , wherein the second sheet metal member has a structure symmetrical to that of the first sheet metal member. 
     
     
       17. The high power LED package according to  claim 12 , wherein the first and second sheet metal members are protruded at their lower ends downwardly from the bottom face of the package body. 
     
     
       18. The high power LED package according to  claim 12 , further comprising a high reflectivity reflective layer coated on the inner surface of the recess. 
     
     
       19. The high power LED package according to  claim 12 , further comprising a lens assembled onto the upper surface of the package body, and wherein the package body has a step at its upper edge so as to be engaged with the lower portion of the lens. 
     
     
       20. A high power Light Emitting Diode (LED) package mounted on a board, which includes a metal plate of a heat sink, an insulating layer on the metal plate and a conductive pattern printed with plural pattern lines on the insulating layer, the high power LED package comprising:
 an LED chip;   a package body integrally formed with resin to have a recess for receiving the LED chip;   a first sheet metal member electrically connected with the LED chip while supporting the LED chip at its upper partial portion in the recess, the first sheet metal member surrounded by the package body and extending to the side face of the package body, with a partial bottom surface of the first sheet metal member bent downward to be exposed through the bottom face of the package body and to contact the conductive pattern of the board;   a second sheet metal member electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, the second sheet metal member extending through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member; and   a transparent sealant sealingly filled up into the recess.   
     
     
       21. The high power LED package according to  claim 20 , wherein the bent shape of the first sheet metal member is formed by etching or press working of a source sheet metal. 
     
     
       22. The high power LED package according to  claim 20 , wherein a lower portion of the first sheet metal member is exposed at a middle portion in length through the bottom face of the package body. 
     
     
       23. The high power LED package according to  claim 22 , wherein the exposed lower portion of the first sheet metal member is extended out of the bottom face of the package body. 
     
     
       24. The high power LED package according to  claim 20 , wherein the first sheet metal member is exposed at the lower portion adjacent to one end thereof through the bottom face of the package body to contact the board. 
     
     
       25. The high power LED package according to  claim 20 , wherein the other end of the first sheet metal member is protruded out of a sidewall of the package body. 
     
     
       26. The high power LED package according to  claim 20 , wherein the bottom surface of the first sheet metal member adjacent to one side thereof is cut at a slant away from the second sheet metal member, and the cut portion of the heat transfer section is covered with the package body. 
     
     
       27. The high power LED package according to  claim 20 , wherein the second sheet metal member has a structure symmetrical to that of the first sheet metal member. 
     
     
       28. The high power LED package according to  claim 20 , further comprising a high reflectivity reflective layer coated on the inner surface of the recess. 
     
     
       29. The high power LED package according to  claim 20 , further comprising a lens assembled onto the upper surface of the package body, and wherein the package body has a step at its upper edge so as to be engaged with the lower portion of the lens. 
     
     
       30. A high power Light Emitting Diode (LED) package, comprising:
 an LED chip;   a package body integrally formed with resin to have a recess for receiving the LED chip;   a first sheet metal member electrically connected with the LED chip, the first sheet metal member having an upper partial portion supporting the LED chip in the recess, the first sheet metal member being surrounded by the package body and extending to a side face of the package body to be exposed to an outside of the package body, the first sheet metal member having a section extending downward from an inside of the package body so that a lower end of the section is exposed at a bottom face of the package body, such that the first sheet metal member is formed as a single body;   a second sheet metal member electrically connected with the LED chip and spaced apart from the first sheet metal member by a predetermined gap, the second sheet metal member extending through the inside of the package body to the side face of the package body; and   a transparent sealant sealingly filled in the recess,   wherein the first sheet metal member is a sheet metal extending continuously and integrally without any bonding or attachment, from the lower end exposed through the bottom face of the package body, through the inside of the package body and to the side face of the package body where the first sheet metal member is again exposed to the outside.