Inventor
LEE SEON GOO
KR47 patents
⚠️ This page may combine multiple inventors who share the name “LEE SEON GOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
21 patentsUS7501656B2Mar 10, 2009
Light emitting diode package with diffuser and method of manufacturing the same
SAMSUNG ELECTRO MECH486 citations99
US7458703B2Dec 2, 2008
Light emitting diode package having dual lens structure for lateral light emission
SAMSUNG ELECTRO MECH60 citations98
US7208772B2Apr 24, 2007
High power light emitting diode package
SAMSUNG ELECTRO MECH69 citations98
US7156538B2Jan 2, 2007
LED package for backlight unit
SAMSUNG ELECTRO MECH66 citations97
US7714342B2May 11, 2010
Chip coated light emitting diode package and manufacturing method thereof
SAMSUNG ELECTRO MECH41 citations96
US7683470B2Mar 23, 2010
LED package
SAMSUNG ELECTRO MECH35 citations93
US7626250B2Dec 1, 2009
High power LED package and fabrication method thereof
SAMSUNG ELECTRO MECH19 citations93
US7566912B2Jul 28, 2009
Light emitting diode package
SAMSUNG ELECTRO MECH21 citations93
US7498610B2Mar 3, 2009
High power LED housing and fabrication method thereof
SAMSUNG ELECTRO MECH16 citations93
USD512694SDec 13, 2005
Light-emitting diode
SAMSUNG ELECTRO MECH33 citations93
USD512029SNov 29, 2005
Light-emitting diode
SAMSUNG ELECTRO MECH27 citations93
USD568261SMay 6, 2008
Light-emitting diode
SAMSUNG ELECTRO MECH22 citations91
US7846752B2Dec 7, 2010
High power LED housing and fabrication method thereof
SAMSUNG ELECTRO MECH8 citations84
US7687292B2Mar 30, 2010
Light emitting diode package with metal reflective layer and method of manufacturing the same
SAMSUNG ELECTRO MECH12 citations84
US7663199B2Feb 16, 2010
High power light emitting diode package and fabrication method thereof
SAMSUNG ELECTRO MECH9 citations84
US7338823B2Mar 4, 2008
Side-emitting LED package and manufacturing method of the same
SAMSUNG ELECTRO MECH16 citations84
US7462871B2Dec 9, 2008
Side-view light emitting diode having protective device
SAMSUNG ELECTRO MECH16 citations83
US7903410B2Mar 8, 2011
Package board and method for manufacturing thereof
SAMSUNG ELECTRO MECH4 citations62
US7157029B2Jan 2, 2007
Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production method
SAMSUNG ELECTRO MECH2 citations60
US7678592B2Mar 16, 2010
LED housing and fabrication method thereof
SAMSUNG ELECTRO MECH4 citations58
US7560057B2Jul 14, 2009
Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production method
SAMSUNG ELECTRO MECH0 citations50
AMKOR TECHNOLOGY INC
11 patentsUS6982485B1Jan 3, 2006
Stacking structure for semiconductor chips and a semiconductor package using it
AMKOR TECHNOLOGY INC69 citations98
US6798049B1Sep 28, 2004
Semiconductor package and method for fabricating the same
AMKOR TECHNOLOGY INC125 citations98
US6515356B1Feb 4, 2003
Semiconductor package and method for fabricating the same
AMKOR TECHNOLOGY INC79 citations97
US6982488B2Jan 3, 2006
Semiconductor package and method for fabricating the same
AMKOR TECHNOLOGY INC45 citations96
US7211900B2May 1, 2007
Thin semiconductor package including stacked dies
AMKOR TECHNOLOGY INC26 citations92
US6936922B1Aug 30, 2005
Semiconductor package structure reducing warpage and manufacturing method thereof
AMKOR TECHNOLOGY INC49 citations92
US6995448B2Feb 7, 2006
Semiconductor package including passive elements and method of manufacture
AMKOR TECHNOLOGY INC33 citations90
US6469258B1Oct 22, 2002
Circuit board for semiconductor package
AMKOR TECHNOLOGY INC35 citations90
US6717248B2Apr 6, 2004
Semiconductor package and method for fabricating the same
AMKOR TECHNOLOGY INC27 citations89
US7190071B2Mar 13, 2007
Semiconductor package and method for fabricating the same
AMKOR TECHNOLOGY INC13 citations83
USRE40112EFeb 26, 2008
Semiconductor package and method for fabricating the same
AMKOR TECHNOLOGY INC1 citations52
LEE SEON GOO
7 patentsUS8324646B2Dec 4, 2012
Chip coated light emitting diode package and manufacturing method thereof
LEE SEON GOO479 citations98
US8105854B2Jan 31, 2012
LED package
LEE SEON GOO28 citations92
US8202746B2Jun 19, 2012
Method of manufacturing LED package for formation of molding member
LEE SEON GOO7 citations82
USRE44811EMar 18, 2014
High power light emitting diode package
LEE SEON GOO0 citations52
USRE43200EFeb 21, 2012
High power light emitting diode package
LEE SEON GOO0 citations52
USRE45596EJun 30, 2015
High power light emitting diode package
LEE SEON GOO0 citations45
US8169128B2May 1, 2012
LED package having recess in heat conducting part
LEE SEON GOO0 citations41
SAMSUNG LED CO LTD
5 patentsUS8013352B2Sep 6, 2011
Chip coated light emitting diode package and manufacturing method thereof
SAMSUNG LED CO LTD479 citations99
US7790482B2Sep 7, 2010
Light emitting diode package with diffuser and method of manufacturing the same
SAMSUNG LED CO LTD474 citations99
US7833811B2Nov 16, 2010
Side-emitting LED package and method of manufacturing the same
SAMSUNG LED CO LTD14 citations84
US7875476B2Jan 25, 2011
High power LED package and fabrication method thereof
SAMSUNG LED CO LTD5 citations63
US7795052B2Sep 14, 2010
Chip coated light emitting diode package and manufacturing method thereof
SAMSUNG LED CO LTD3 citations63