Assignee
LEE YONG-KWAN
KR·4 granted patents·4 pending applications·18 citations·filing 2006–2014
Top patents by PatentIndex Score
8 records- 0186US8241968B2Printed circuit board (PCB) including a wire pattern, semiconductor package including the PCB, electrical and electronic apparatus including the semiconductor package, method of fabricating the PCB, and method of fabricating the semiconductor packageLEE YONG-KWAN·Filed 2010·Granted Aug 14, 2012·8 cites·16 claims
- 0282US9041180B2Semiconductor package and method of manufacturing the semiconductor packageLEE YONG-KWAN·Filed 2014·Granted May 26, 2015·6 cites·20 claims
- 0376US9282624B2Antenna structure and plasma generating deviceLEE YONG KWAN·Filed 2011·Granted Mar 8, 2016·4 cites·6 claims
- 0453US2011072447A1Disk drive motorLEE YONG KWAN·Filed 2009·Application pending·0 cites
- 0550US8213112B2Motor having a pressure difference generation portion disposed in a space between a disk and rotor case and disk drive apparatus including the motorLEE YONG KWAN·Filed 2009·Granted Jul 3, 2012·0 cites·11 claims
- 0647US2012307445A1Printed circuit board (pcb) including a wire pattern, semiconductor package including the pcb, electrical and electronic apparatus including the semiconductor package, method of fabricating the pcb, and method of fabricating the semiconductor packageLEE YONG-KWAN·Filed 2012·Application pending·0 cites
- 0742US2006255471A1Flip chip package having protective cap and method of fabricating the sameLEE YONG-KWAN·Filed 2006·Application pending·0 cites
- 0839US2012168937A1Flip chip package and method of manufacturing the sameLEE YONG-KWAN·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →