Assignee
LIM SEUNG-WON
KR·1 granted patent·3 pending applications·6 citations·filing 2008–2009
Top patents by PatentIndex Score
4 records- 0172US8766419B2Power module having stacked flip-chip and method of fabricating the power moduleLIM SEUNG-WON·Filed 2009·Granted Jul 1, 2014·6 cites·9 claims
- 0245US2009243078A1Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the SameLIM SEUNG-WON·Filed 2009·Application pending·0 cites
- 0340US2009243079A1Semiconductor device packageLIM SEUNG-WON·Filed 2009·Application pending·0 cites
- 0439US2009244848A1Power Device Substrates and Power Device Packages Including the SameLIM SEUNG-WON·Filed 2008·Application pending·0 cites
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