Assignee
LIOU SHIANN-MING
US·8 granted patents·1 pending application·82 citations·filing 2004–2012
Top patents by PatentIndex Score
9 records- 0198US8471376B1Integrated circuit packaging configurationsLIOU SHIANN-MING·Filed 2010·Granted Jun 25, 2013·49 cites·19 claims
- 0289US8482112B1Semiconductor packageLIOU SHIANN-MING·Filed 2011·Granted Jul 9, 2013·8 cites·16 claims
- 0383US8637975B1Semiconductor device having lead wires connecting bonding pads formed on opposite sides of a core region forming a shield areaLIOU SHIANN-MING·Filed 2012·Granted Jan 28, 2014·5 cites·10 claims
- 0481US8319353B1Pre-formed conductive bumps on bonding padsLIOU SHIANN-MING·Filed 2011·Granted Nov 27, 2012·5 cites·21 claims
- 0569US8754506B1Through via semiconductor die with backside redistribution layerLIOU SHIANN-MING·Filed 2009·Granted Jun 17, 2014·3 cites·7 claims
- 0669US8673689B2Single layer BGA substrate processLIOU SHIANN-MING·Filed 2012·Granted Mar 18, 2014·2 cites·13 claims
- 0767US8258616B1Semiconductor dice having a shielded area created under bond wires connecting pairs of bonding padsLIOU SHIANN-MING·Filed 2004·Granted Sep 4, 2012·10 cites·23 claims
- 0847US8987830B2Attaching passive components to a semiconductor packageLIOU SHIANN-MING·Filed 2010·Granted Mar 24, 2015·0 cites·12 claims
- 0946US2011175218A1Package assembly having a semiconductor substrateLIOU SHIANN-MING·Filed 2010·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →