Assignee
LIU CHUNG-SHI
TW·12 granted patents·4 pending applications·111 citations·filing 2007–2011
Top patents by PatentIndex Score
16 records- 0197US8324738B2Self-aligned protection layer for copper post structureLIU CHUNG-SHI·Filed 2010·Granted Dec 4, 2012·26 cites·20 claims
- 0295US8629560B2Self aligned air-gap in interconnect structuresLIU CHUNG-SHI·Filed 2010·Granted Jan 14, 2014·21 cites·20 claims
- 0394US9024431B2Semiconductor die contact structure and methodLIU CHUNG-SHI·Filed 2010·Granted May 5, 2015·12 cites·18 claims
- 0492US8609526B2Preventing UBM oxidation in bump formation processesLIU CHUNG-SHI·Filed 2010·Granted Dec 17, 2013·16 cites·20 claims
- 0585US8664070B2High temperature gate replacement processLIU CHUNG-SHI·Filed 2009·Granted Mar 4, 2014·10 cites·20 claims
- 0684US8617946B2Integrated circuits including metal gates and fabrication methods thereofLIU CHUNG-SHI·Filed 2010·Granted Dec 31, 2013·5 cites·12 claims
- 0784US8569897B2Protection layer for preventing UBM layer from chemical attack and oxidationLIU CHUNG-SHI·Filed 2010·Granted Oct 29, 2013·7 cites·20 claims
- 0881US8294274B2Semiconductor contact barrierLIU CHUNG-SHI·Filed 2011·Granted Oct 23, 2012·4 cites·20 claims
- 0976US8198685B2Transistors with metal gate and methods for forming the sameLIU CHUNG-SHI·Filed 2008·Granted Jun 12, 2012·6 cites·18 claims
- 1071US8319342B2Interconnect structures having permeable hard mask for sealing air gap contained by conductive structuresLIU CHUNG-SHI·Filed 2010·Granted Nov 27, 2012·2 cites·19 claims
- 1170US8440562B2Germanium-containing dielectric barrier for low-K processLIU CHUNG-SHI·Filed 2010·Granted May 14, 2013·2 cites·15 claims
- 1252US9123553B2Method and system for bonding 3D semiconductor deviceLIU CHUNG-SHI·Filed 2011·Granted Sep 1, 2015·0 cites·20 claims
- 1350US2007117374A1Method of forming via recess in underlying conductive lineLIU CHUNG-SHI·Filed 2007·Application pending·0 cites
- 1444US2008185722A1Formation process of interconnect structures with air-gaps and sidewall spacersLIU CHUNG-SHI·Filed 2007·Application pending·0 cites
- 1540US2013146647A1Integrated Reflow and Cleaning Process and Apparatus for Performing the SameLIU CHUNG-SHI·Filed 2011·Application pending·0 cites
- 1638US2012009777A1UBM Etching MethodsLIU CHUNG-SHI·Filed 2010·Application pending·0 cites
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