Assignee
LIU HUANG
SG·1 granted patent·3 pending applications·12 citations·filing 2011–2012
Top patents by PatentIndex Score
4 records- 0186US8518775B2Integration of eNVM, RMG, and HKMG modulesLIU HUANG·Filed 2011·Granted Aug 27, 2013·12 cites·18 claims
- 0237US2014117545A1Copper hillock prevention with hydrogen plasma treatment in a dedicated chamberLIU HUANG·Filed 2012·Application pending·0 cites
- 0337US2011316085A1Integrated circuit including a stressed dielectric layer with stable stressLIU HUANG·Filed 2011·Application pending·0 cites
- 0434US2012273949A1Method of forming oxide encapsulated conductive featuresLIU HUANG·Filed 2011·Application pending·0 cites
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