Assignee
MADRID RUBEN P
PH·2 granted patents·2 pending applications·29 citations·filing 2007–2011
Technology mixH10W4
Top patents by PatentIndex Score
4 records- 0188US8193622B2Thermally enhanced thin semiconductor packageMADRID RUBEN P·Filed 2010·Granted Jun 5, 2012·11 cites·25 claims
- 0287US8193618B2Semiconductor die package with clip interconnectionMADRID RUBEN P·Filed 2008·Granted Jun 5, 2012·18 cites·20 claims
- 0347US2009057852A1Thermally enhanced thin semiconductor packageMADRID RUBEN P·Filed 2007·Application pending·0 cites
- 0445US2011244633A1Package assembly for semiconductor devicesMADRID RUBEN P·Filed 2011·Application pending·0 cites
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