Assignee
MAGNUS ALAN J
US·4 granted patents·1 pending application·79 citations·filing 2012–2014
Top patents by PatentIndex Score
5 records- 0195US8822268B1Redistributed chip packages containing multiple components and methods for the fabrication thereofMAGNUS ALAN J·Filed 2013·Granted Sep 2, 2014·32 cites·20 claims
- 0290US9401338B2Electronic devices with embedded die interconnect structures, and methods of manufacture thereofMAGNUS ALAN J·Filed 2012·Granted Jul 26, 2016·42 cites·19 claims
- 0377US8685790B2Semiconductor device package having backside contact and method for manufacturingMAGNUS ALAN J·Filed 2012·Granted Apr 1, 2014·5 cites·12 claims
- 0450US2014167247A1Semiconductor device package having backside contact and method for manufacturingMAGNUS ALAN J·Filed 2014·Application pending·0 cites
- 0544US9281293B2Microelectronic packages having layered interconnect structures and methods for the manufacture thereofMAGNUS ALAN J·Filed 2013·Granted Mar 8, 2016·0 cites·20 claims
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