Semiconductor device package having backside contact and method for manufacturing

Abstract

A method and apparatus for forming a backside contact, electrical and/or thermal, for die encapsulated in a semiconductor device package are provided. Die of varying thicknesses can be accommodated within the semiconductor device package. Embodiments of the present invention provide a conductive pedestal coupled to a backside contact of a die, where the coupling is performed prior to encapsulating the die within the package. In addition, conductive pedestals coupled to varying die within a semiconductor device package are of such a thickness that each conductive pedestal can be exposed on the back side of the package without exposing or damaging the backside of any encapsulated die. Embodiments of the present invention provide for the conductive pedestals being made of electrically or thermally conductive material and coupled to the device die contact using an electrically and/or thermally conductive adhesive.

What is claimed is: 
     
         1 - 13 . (canceled) 
     
     
         14 . A packaged electronic device assembly comprising:
 a die comprising a first major surface having a die contact and a second major surface having one or more electronic contacts;   a conductive pedestal coupled to the die contact at a major surface of the conductive pedestal, wherein the major surface of the conductive pedestal has an area that is less than an area of the first major surface of the die; and   encapsulant over and around the die and the conductive pedestal forming the packaged electronic device assembly, wherein
 a free surface of the conductive pedestal is exposed, 
 the one or more electronic contacts are exposed at an opposite major surface of the packaged electronic device assembly from the exposed conductive pedestal, and 
 the free surface of the conductive pedestal is opposite to the major surface of the conductive pedestal. 
   
     
     
         15 . The packaged electronic device assembly of  claim 14  further comprising:
 a conductive adhesive coupling the die contact to the conductive pedestal, wherein the conductive adhesive is one or more of thermally conductive and electrically conductive. 
 
     
     
         16 . The packaged electronic device assembly of  claim 15  wherein the conductive adhesive comprises one of solder or conductive epoxy. 
     
     
         17 . The packaged electronic device assembly of  claim 14  wherein the conductive pedestal comprises one or more of copper, nickel, gold, aluminum, ceramic, or a metal alloy. 
     
     
         18 . The packaged electronic device assembly of  claim 14  further comprising:
 a heat sink coupled to the free surface of the conductive pedestal, wherein the die contact is a thermal contact. 
 
     
     
         19 . The packaged electronic device assembly of  claim 14  further comprising:
 a second electronic device contact coupled to the free surface of the conductive pedestal, wherein the die contact is an electronic contact.