Inventor · disambiguated record
Douglas G. Mitchell
Also filed as: MITCHELL DOUGLAS G
27 granted patents·2 pending applications·1,080 citations·filing 1988–2014
97Inventor score
Top patents by PatentIndex Score
29 records- 0197US4927505AMetallization scheme providing adhesion and barrier propertiesMOTOROLA INC·Filed 1989·Granted May 22, 1990·184 cites·17 claims
- 0296US7425464B2Semiconductor device packagingFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Sep 16, 2008·85 cites·18 claims
- 0395US5773359AInterconnect system and method of fabricationMOTOROLA INC·Filed 1995·Granted Jun 30, 1998·219 cites·11 claims
- 0494US8216918B2Method of forming a packaged semiconductor deviceGONG ZHIWEI·Filed 2010·Granted Jul 10, 2012·22 cites·5 claims
- 0594US6372622B1Fine pitch bumping with improved device standoff and bump volumeMOTOROLA INC·Filed 1999·Granted Apr 16, 2002·180 cites·23 claims
- 0694US5480835AElectrical interconnect and method for forming the sameMOTOROLA INC·Filed 1994·Granted Jan 2, 1996·107 cites·20 claims
- 0791US6878633B2Flip-chip structure and method for high quality inductors and transformersFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Apr 12, 2005·75 cites·11 claims
- 0890US7935571B2Through substrate vias for back-side interconnections on very thin semiconductor wafersFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted May 3, 2011·18 cites·10 claims
- 0990US4880708AMetallization scheme providing adhesion and barrier propertiesMOTOROLA INC·Filed 1988·Granted Nov 14, 1989·61 cites·12 claims
- 1088US7981730B2Integrated conformal shielding method and process using redistributed chip packagingFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jul 19, 2011·17 cites·17 claims
- 1187US8158492B2MEMS microphone with cavity and method thereforLIU LIANJUN·Filed 2009·Granted Apr 17, 2012·13 cites·11 claims
- 1286US9142502B2Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduitsGONG ZHIWEI·Filed 2011·Granted Sep 22, 2015·9 cites·13 claims
- 1384US8283207B2Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methodsRAMIAH CHANDRASEKARAM·Filed 2011·Granted Oct 9, 2012·9 cites·20 claims
- 1482US9123685B2Microelectronic packages having frontside thermal contacts and methods for the fabrication thereofYAP WENG FOONG·Filed 2013·Granted Sep 1, 2015·6 cites·20 claims
- 1577US8685790B2Semiconductor device package having backside contact and method for manufacturingMAGNUS ALAN J·Filed 2012·Granted Apr 1, 2014·5 cites·12 claims
- 1676US6413878B1Method of manufacturing electronic componentsMOTOROLA INC·Filed 2000·Granted Jul 2, 2002·12 cites·11 claims
- 1775US9502363B2Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layersVINCENT MICHAEL B·Filed 2014·Granted Nov 22, 2016·4 cites·16 claims
- 1875US7950144B2Method for controlling warpage in redistributed chip packaging panelsFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted May 31, 2011·7 cites·19 claims
- 1974US6517698B1System and method for providing rotation to plating flowMOTOROLA INC·Filed 2000·Granted Feb 11, 2003·8 cites·5 claims
- 2067US9520323B2Microelectronic packages having trench vias and methods for the manufacture thereofVINCENT MICHAEL B·Filed 2012·Granted Dec 13, 2016·2 cites·18 claims
- 2165US6436300B2Method of manufacturing electronic componentsMOTOROLA INC·Filed 1998·Granted Aug 20, 2002·16 cites·8 claims
- 2262USD328588SChock block unitMITCHELL DOUGLAS G·Filed 1990·Granted Aug 11, 1992·12 cites·1 claims
- 2361US9018045B2Microelectronic packages and methods for the fabrication thereofYAP WENG FOONG·Filed 2013·Granted Apr 28, 2015·1 cites·20 claims
- 2457US6726826B2Method of manufacturing a semiconductor componentMOTOROLA INC·Filed 2001·Granted Apr 27, 2004·6 cites·6 claims
- 2550US2014167247A1Semiconductor device package having backside contact and method for manufacturingMAGNUS ALAN J·Filed 2014·Application pending·0 cites
- 2648US6803323B2Method of forming a component overlying a semiconductor substrateFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Oct 12, 2004·2 cites·17 claims
- 2744US9281293B2Microelectronic packages having layered interconnect structures and methods for the manufacture thereofMAGNUS ALAN J·Filed 2013·Granted Mar 8, 2016·0 cites·20 claims
- 2835US2013154091A1Semiconductor device packaging using encapsulated conductive balls for package-on-package back side couplingWRIGHT JASON R·Filed 2011·Application pending·0 cites
- 2926US6361675B1Method of manufacturing a semiconductor component and plating tool thereforMOTOROLA INC·Filed 1999·Granted Mar 26, 2002·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →