Assignee
MASUMOTO MUTSUMI
JP·1 granted patent·1 pending application·2 citations·filing 2005–2010
Top patents by PatentIndex Score
2 records- 0163US8298947B2Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cyclesMASUMOTO MUTSUMI·Filed 2010·Granted Oct 30, 2012·2 cites·7 claims
- 0242US2007132075A1Structure and method for thin single or multichip semiconductor QFN packagesMASUMOTO MUTSUMI·Filed 2005·Application pending·0 cites
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