Assignee
MAWATARI KAZUAKI
JP·2 granted patents·2 pending applications·37 citations·filing 2010–2012
Technology mixH10W4
Top patents by PatentIndex Score
4 records- 0193US8294261B2Protruding TSV tips for enhanced heat dissipation for IC devicesMAWATARI KAZUAKI·Filed 2010·Granted Oct 23, 2012·37 cites·19 claims
- 0240US8587122B2Semiconductor flip-chip system having three-dimensional solder jointsMAWATARI KAZUAKI·Filed 2011·Granted Nov 19, 2013·0 cites·14 claims
- 0336US2013228916A1Two-solder method for self-aligning solder bumps in semiconductor assemblyMAWATARI KAZUAKI·Filed 2012·Application pending·0 cites
- 0434US2012193778A1Integrated circuit having protruding bonding features with reinforcing dielectric supportsMAWATARI KAZUAKI·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →