Assignee
MIKI SYOTA
JP·3 granted patents·1 pending application·30 citations·filing 2008–2011
Top patents by PatentIndex Score
4 records- 0190US8143531B2Electronic component mounting packageMIKI SYOTA·Filed 2008·Granted Mar 27, 2012·27 cites·3 claims
- 0268US8330279B2Semiconductor deviceMIKI SYOTA·Filed 2011·Granted Dec 11, 2012·3 cites·6 claims
- 0338US2012153507A1Semiconductor device and method for manufacturing the sameMIKI SYOTA·Filed 2011·Application pending·0 cites
- 0437US8779573B2Semiconductor package having a silicon reinforcing member embedded in resinMIKI SYOTA·Filed 2011·Granted Jul 15, 2014·0 cites·3 claims
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