Assignee
MISUMI SADAHITO
JP·4 granted patents·2 pending applications·13 citations·filing 2006–2012
Top patents by PatentIndex Score
6 records- 0179US8278153B2Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained therebyMISUMI SADAHITO·Filed 2010·Granted Oct 2, 2012·4 cites·16 claims
- 0273US8236614B2Semiconductor device manufacturing methodMISUMI SADAHITO·Filed 2006·Granted Aug 7, 2012·5 cites·14 claims
- 0372US8703584B2Dicing tape-integrated film for semiconductor back surfaceMISUMI SADAHITO·Filed 2010·Granted Apr 22, 2014·4 cites·5 claims
- 0453US8975759B2Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained therebyMISUMI SADAHITO·Filed 2012·Granted Mar 10, 2015·0 cites·7 claims
- 0548US2012189845A1Semiconductor device manufacturing methodMISUMI SADAHITO·Filed 2012·Application pending·0 cites
- 0639US2010219507A1Process for producing semiconductor deviceMISUMI SADAHITO·Filed 2007·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →