Assignee
MIYAKAWA HIDENORI
JP·1 granted patent·3 pending applications·2 citations·filing 2006–2012
Top patents by PatentIndex Score
4 records- 0158US8205327B2Method for manufacturing circuit board on which electronic component is mountedMIYAKAWA HIDENORI·Filed 2006·Granted Jun 26, 2012·2 cites·5 claims
- 0243US2009236036A1Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable compositionMIYAKAWA HIDENORI·Filed 2007·Application pending·0 cites
- 0343US2013344369A1Secondary battery unitMIYAKAWA HIDENORI·Filed 2012·Application pending·0 cites
- 0442US2009032293A1Electroconductive Bonding Material and Electric/Electronic Device Using the SameMIYAKAWA HIDENORI·Filed 2006·Application pending·0 cites
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