Electroconductive Bonding Material and Electric/Electronic Device Using the Same

Abstract

A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.

1 - 10 . (canceled) 
     
     
         11 . A conductive bonding material comprising a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin characterized in that said epoxy resin ingredient has a linear or cyclic sulfur-containing compound. 
     
     
         12 . The conductive bonding material according to  claim 11 , characterized in that the material further contains a thickening agent. 
     
     
         13 . The conductive bonding material according to  claim 11 , characterized in that the conductive particle ingredient is metallic particles, the sulfur-containing compound coordinates with the surface of the metallic particles, and the thiol containing compound dissociates from the surface of the metallic particles to form an epoxy hardening agent ingredient upon being subjected with a predetermined condition. 
     
     
         14 . The conductive bonding material according to  claim 13 , characterized in that the metallic particles are selected from the group of gold, silver and copper particles. 
     
     
         15 . The conductive bonding material according to  claim 13 , characterized in that the operation to be subjected to a predetermined condition is selected from the conditions comprising being irradiated with ultraviolet ray or electron ray, or being heated. 
     
     
         16 . The conductive bonding material according to  claim 11 , characterized in that the metallic particles have a mean diameter in a range from 1 nm to 100 μm. 
     
     
         17 . The conductive bonding material according to  claim 11 , characterized in that the material further contains a fragrance material. 
     
     
         18 . The conductive bonding material according to  claim 17 , characterized in that the conductive particles ingredient is metallic particle and that the fragrance material is a material having a reducing ability. 
     
     
         19 . A method of preparing an electric/electronic circuit board comprising; applying a conductive bonding material according to  claim 11  to a surface of a board; followed by activating an epoxy resin hardening agent. 
     
     
         20 . An electric/electronic device having one or more circuit boards that were prepared through the method according to  claim 19 .