Inventor · disambiguated record
Takayuki Higuchi
Also filed as: HIGUCHI TAKAYUKI
27 granted patents·15 pending applications·97 citations·filing 2001–2025
94Inventor score
Top patents by PatentIndex Score
42 records- 0193US6840996B2Cement compositionDENKI KAGAKU KOGYO KK·Filed 2001·Granted Jan 11, 2005·53 cites·8 claims
- 0287US9348252B2Image forming apparatusBROTHER IND LTD·Filed 2015·Granted May 24, 2016·4 cites·27 claims
- 0386US10509351B2Fixing device fixing developing agent image to sheet by electrostatically spraying charged fixing solutionBROTHER IND LTD·Filed 2018·Granted Dec 17, 2019·2 cites·19 claims
- 0480US7785500B2Electrically conductive adhesivePANASONIC CORP·Filed 2006·Granted Aug 31, 2010·9 cites·7 claims
- 0579US10093577B2Fiber-reinforced carbonated hydraulic inorganic molded plate and method for producing sameKURARAY CO·Filed 2016·Granted Oct 9, 2018·2 cites·17 claims
- 0673US7527689B2Cement admixture, cement composition, and method for suppressing carbonation using the sameDENKI KAGAKU KOGYO KK·Filed 2007·Granted May 5, 2009·3 cites·13 claims
- 0769US11698596B2Fixing device fixing developing agent image to sheet by electrostatically spraying charged fixing solutionBROTHER IND LTD·Filed 2021·Granted Jul 11, 2023·0 cites·18 claims
- 0869US11009820B2Fixing device fixing developing agent image to sheet by electrostatically spraying charged fixing solutionBROTHER IND LTD·Filed 2019·Granted May 18, 2021·0 cites·19 claims
- 0966US8163599B2Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatusTOMURA YOSHIHIRO·Filed 2009·Granted Apr 24, 2012·4 cites·5 claims
- 1064US12204259B2Fixing liquidBROTHER IND LTD·Filed 2019·Granted Jan 21, 2025·0 cites·19 claims
- 1163US8697237B2Thermosetting resin composition, method of manufacturing the same and circuit boardPANASONIC CORP·Filed 2013·Granted Apr 15, 2014·0 cites·8 claims
- 1263US8663383B2Expansive material and its preparation processHIGUCHI TAKAYUKI·Filed 2010·Granted Mar 4, 2014·1 cites·9 claims
- 1362US8540903B2Electrically conductive paste, and electrical and electronic device comprising the sameHIGUCHI TAKAYUKI·Filed 2008·Granted Sep 24, 2013·3 cites·6 claims
- 1462US7207841B2Electrical connectorMITSUBISHI CABLE IND LTD·Filed 2003·Granted Apr 24, 2007·13 cites·4 claims
- 1560US2024429644A1Connector and connector connection structureFURUKAWA ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1659US8663384B2Cement admixture and cement compositionHIGUCHI TAKAYUKI·Filed 2011·Granted Mar 4, 2014·1 cites·5 claims
- 1759US2010147567A1Thermosetting Resin Composition, Method of Manufacturing the Same and Circuit BoardPANASONIC ELEC WORKS CO LTD·Filed 2007·Application pending·0 cites
- 1858US2025282166A1Layer formation method, substrate regeneration method, and printed matter production methodBROTHER IND LTD·Filed 2025·Application pending·0 cites
- 1957US11911861B2Machining systemDMG MORI CO LTD·Filed 2019·Granted Feb 27, 2024·0 cites·4 claims
- 2057US11392051B2Image forming method, image forming device and setBROTHER IND LTD·Filed 2020·Granted Jul 19, 2022·0 cites·17 claims
- 2157US8182923B2Conductive paste and mounting structure using the sameOHASHI NAOMICHI·Filed 2009·Granted May 22, 2012·1 cites·17 claims
- 2255US2024275105A1Connector and retainerFURUKAWA ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 2353US12124198B2Image forming method and image forming apparatusBROTHER IND LTD·Filed 2020·Granted Oct 22, 2024·0 cites·20 claims
- 2453US2022298077A1Floor patching compositionDENKA COMPANY LTD·Filed 2020·Application pending·0 cites
- 2552US8012379B2Electroconductive bonding material and electric/electronic device using the samePANASONIC CORP·Filed 2010·Granted Sep 6, 2011·0 cites·19 claims
- 2651US10300572B2Workpiece loader deviceDMG MORI CO LTD·Filed 2016·Granted May 28, 2019·0 cites·4 claims
- 2751US8383714B2Alumina fiber aggregate, process for producing the same, and use thereofDENKI KAGAKU KOGYO KK·Filed 2012·Granted Feb 26, 2013·0 cites·8 claims
- 2850US8436253B2Method of manufacturing mounting structure and mounting structureHIGUCHI TAKAYUKI·Filed 2009·Granted May 7, 2013·0 cites·7 claims
- 2948US7459020B2Cement admixture, cement composition, and cement concrete made therefromDENKI KAGAKU KOGYO KK·Filed 2002·Granted Dec 2, 2008·1 cites·19 claims
- 3047US2009086114A1Liquid crystal display device equipped with touch panel and manufacturing method thereofHITACHI DISPLAYS LTD·Filed 2008·Application pending·0 cites
- 3147US2009079706A1Display DeviceHITACHI DISPLAYS LTD·Filed 2008·Application pending·0 cites
- 3246US11817398B2Conductive pasteNAMICS CORP·Filed 2019·Granted Nov 14, 2023·0 cites·9 claims
- 3346US8273816B2Alumina fiber aggregate, process for producing the same, and use thereofOHSHIMA YASUTAKA·Filed 2008·Granted Sep 25, 2012·0 cites·3 claims
- 3444US2013008698A1Multilayer wiring board, production method of the same, and via pastePANASONIC CORP·Filed 2011·Application pending·0 cites
- 3542US2009032293A1Electroconductive Bonding Material and Electric/Electronic Device Using the SameMIYAKAWA HIDENORI·Filed 2006·Application pending·0 cites
- 3640US2004216644A1Cement admixture, cement composition, and method for suppressing carbonation using the sameFiled 2002·Application pending·0 cites
- 3740US2020309274A1Diaphragm valveFUJIKIN KK·Filed 2018·Application pending·0 cites
- 3839US8425679B2Calcium ferroaluminate compound, cement admixture and its manufacturing methods, and cement compositionMORI TAIICHIRO·Filed 2010·Granted Apr 23, 2013·0 cites·8 claims
- 3939US2013068513A1Wiring board, production method of the same, and via pasteHIRAI SHOGO·Filed 2011·Application pending·0 cites
- 4038US2009301771A1Conductive bump, method for forming the same, and electronic component mounting structure using the sameOCHI SHOZO·Filed 2009·Application pending·0 cites
- 4137US2010276803A1Semiconductor device and method of manufacturing the samePANASONIC CORP·Filed 2010·Application pending·0 cites
- 4236US2013062107A1Multilayer wiring board and production method of the sameHIGUCHI TAKAYUKI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →