Assignee
NALLA RAVI K
US·8 granted patents·5 pending applications·145 citations·filing 2006–2013
Top patents by PatentIndex Score
13 records- 0197US8304913B2Methods of forming fully embedded bumpless build-up layer packages and structures formed therebyNALLA RAVI K·Filed 2010·Granted Nov 6, 2012·46 cites·11 claims
- 0296US8618652B2Forming functionalized carrier structures with coreless packagesNALLA RAVI K·Filed 2010·Granted Dec 31, 2013·30 cites·15 claims
- 0396US8319318B2Forming metal filled die back-side film for electromagnetic interference shielding with coreless packagesNALLA RAVI K·Filed 2010·Granted Nov 27, 2012·42 cites·16 claims
- 0494US8431438B2Forming in-situ micro-feature structures with coreless packagesNALLA RAVI K·Filed 2010·Granted Apr 30, 2013·17 cites·13 claims
- 0588US8580616B2Methods of forming fully embedded bumpless build-up layer packages and structures formed therebyNALLA RAVI K·Filed 2012·Granted Nov 12, 2013·8 cites·13 claims
- 0669US8507324B2Forming metal filled die back-side film for electromagnetic interference shielding with coreless packagesNALLA RAVI K·Filed 2012·Granted Aug 13, 2013·2 cites·13 claims
- 0753US8896116B2Microelectronic package and method of manufacturing sameNALLA RAVI K·Filed 2013·Granted Nov 25, 2014·0 cites·13 claims
- 0850US2009061232A1Methods of laser surface modification of ceramic packages for underfill spread control and structures formed therebyNALLA RAVI K·Filed 2008·Application pending·0 cites
- 0948US8183692B2Barrier layer for fine-pitch mask-based substrate bumpingNALLA RAVI K·Filed 2010·Granted May 22, 2012·0 cites·7 claims
- 1048US2011108999A1Microelectronic package and method of manufacturing sameNALLA RAVI K·Filed 2009·Application pending·0 cites
- 1147US2008241547A1Methods of laser surface modification of ceramic packages for underfill spread control and structures formed therebyNALLA RAVI K·Filed 2007·Application pending·0 cites
- 1245US2011316140A1Microelectronic package and method of manufacturing sameNALLA RAVI K·Filed 2010·Application pending·0 cites
- 1345US2007269973A1Method of providing solder bumps using reflow in a forming gas atmosphereNALLA RAVI K·Filed 2006·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →