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NAMICS CORP
JP71 patents
Top patents by PatentIndex Score
US6498200B1Dec 24, 2002
Cationically polymerizable resin composition
NAMICS CORP31 citations92
US5714238AFeb 3, 1998
Conductive adhesive and circuit using the same
NAMICS CORP32 citations89
US11773301B2Oct 3, 2023
Resin composition
NAMICS CORP2 citations73
US10472461B2Nov 12, 2019
Semiconductor device and image sensor module
NAMICS CORP2 citations73
US10276277B2Apr 30, 2019
Resin composition, copper paste, and semiconductor device
NAMICS CORP2 citations73
US6841415B2Jan 11, 2005
Flip chip mounting method which avoids void formation between a semiconductor chip and a substrate
NAMICS CORP10 citations73
US11230617B2Jan 25, 2022
Resin composition
NAMICS CORP4 citations72
US10141090B2Nov 27, 2018
Resin composition, paste for forming a varistor element, and varistor element
NAMICS CORP3 citations72
US9805998B2Oct 31, 2017
Liquid sealing material and electronic component using same
NAMICS CORP4 citations71
US9795040B2Oct 17, 2017
Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards
NAMICS CORP3 citations71
US10246550B2Apr 2, 2019
Resin composition
NAMICS CORP2 citations69
US10023775B2Jul 17, 2018
Film adhesive and semiconductor device including the same
NAMICS CORP4 citations68
US12146014B2Nov 19, 2024
Curing agent composition for curing 2-methylene-1,3-dicarbonyl compound
NAMICS CORP0 citations63
US11466170B2Oct 11, 2022
Conductive paste
NAMICS CORP0 citations63
US11316203B2Apr 26, 2022
Secondary battery and device including secondary battery
NAMICS CORP0 citations63
US10892242B2Jan 12, 2021
Resin composition, conductive copper paste, and semiconductor device
NAMICS CORP0 citations63
US10294324B2May 21, 2019
Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device
NAMICS CORP1 citations63
US11472957B2Oct 18, 2022
Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module
NAMICS CORP1 citations62
US9263727B2Feb 16, 2016
All solid state secondary battery
NAMICS CORP2 citations62
US7482299B2Jan 27, 2009
Dielectric ceramic composition and multi-layer ceramic capacitor
NAMICS CORP2 citations62
US12304818B2May 20, 2025
Porous carbon and resin composition
NAMICS CORP0 citations61
US11935673B2Mar 19, 2024
Varistor forming paste, cured product thereof, and varistor
NAMICS CORP0 citations61
US12534591B2Jan 27, 2026
Low-voltage varistor, circuit board, semiconductor component package, and interposer
NAMICS CORP0 citations60
US12384874B2Aug 12, 2025
Curing catalyst, resin composition, sealing material, adhesive and cured product
NAMICS CORP0 citations59
US11518867B2Dec 6, 2022
Resin composition, semiconductor sealing material, one-part adhesive and adhesive film
NAMICS CORP0 citations59
US11072710B2Jul 27, 2021
Surface-treated silica filler, and resin composition containing surface-treated silica filler
NAMICS CORP0 citations59
US11817398B2Nov 14, 2023
Conductive paste
NAMICS CORP0 citations58
US11339269B2May 24, 2022
Resin composition for forming varistor and varistor
NAMICS CORP1 citations58
US10290601B2May 14, 2019
Method of manufacturing bonded body
NAMICS CORP1 citations58
US11850625B2Dec 26, 2023
Syringe filled with resin composition and storage method therefor
NAMICS CORP0 citations57
US11315846B2Apr 26, 2022
Semiconductor device
NAMICS CORP1 citations56
US11623813B2Apr 11, 2023
Resin composition-filled syringe, and production method and preservation method for same
NAMICS CORP1 citations55
US9417228B2Aug 16, 2016
Method of predicting viscosity behavior of thermosetting resin, simulation software, method of producing thermosetting resin, and underfill produced in the production method
NAMICS CORP2 citations55
US11781236B2Oct 10, 2023
Composite copper foil
NAMICS CORP0 citations53
US11049983B2Jun 29, 2021
Conductive paste and solar cell
NAMICS CORP0 citations53
US12518889B2Jan 6, 2026
Conductive composition, conductive paste, electric circuit, flexible electric circuit body and method of producing molded body
NAMICS CORP0 citations52
US11932771B2Mar 19, 2024
Stretchable conductive paste and film
NAMICS CORP0 citations52
US10544334B2Jan 28, 2020
Heat conductive paste and method for producing the same
NAMICS CORP0 citations52
US9994729B2Jun 12, 2018
Liquid sealing material, and electronic component using same
NAMICS CORP0 citations52
US11634615B2Apr 25, 2023
Resin composition
NAMICS CORP0 citations51
US10221282B2Mar 5, 2019
Resin composition, adhesive agent, and sealing agent
NAMICS CORP0 citations51
US9926405B2Mar 27, 2018
Resin composition
NAMICS CORP1 citations51
US9457512B2Oct 4, 2016
Lithium ion rechargeable battery and process for producing the lithium ion rechargeable battery
NAMICS CORP1 citations51
US12336116B2Jun 17, 2025
Composite copper components
NAMICS CORP0 citations50
US9748158B2Aug 29, 2017
Liquid sealing material and electronic component using same
NAMICS CORP0 citations50
US9670377B2Jun 6, 2017
Underfill composition for encapsulating a bond line
NAMICS CORP0 citations50
US7932108B2Apr 26, 2011
Method of preparing a sealed light-emitting diode chip
NAMICS CORP1 citations50
US9789546B2Oct 17, 2017
Method for producing a metal particle
NAMICS CORP1 citations49
US9776909B2Oct 3, 2017
Glass frit
NAMICS CORP0 citations49
US9540275B2Jan 10, 2017
Conductive paste and method for producing a semiconductor device using the same
NAMICS CORP0 citations48
Showing the top 50 of 71 patents by PatentIndex Score.