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NEPES CORP
KR5 patents
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US7977789B2Jul 12, 2011
Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same
NEPES CORP64 citations94
US7808095B2Oct 5, 2010
Ultra slim semiconductor package and method of fabricating the same
NEPES CORP17 citations79
US7952210B2May 31, 2011
Semiconductor package and fabrication method thereof
NEPES CORP4 citations59
US7919833B2Apr 5, 2011
Semiconductor package having a crack-propagation preventing unit
NEPES CORP5 citations59
US7906842B2Mar 15, 2011
Wafer level system in package and fabrication method thereof
NEPES CORP4 citations59