Assignee
NIKI AYAO
JP·8 granted patents·1 pending application·35 citations·filing 2008–2012
Top patents by PatentIndex Score
9 records- 0187US8959760B2Printed wiring board and method for manufacturing sameNIKI AYAO·Filed 2011·Granted Feb 24, 2015·8 cites·20 claims
- 0286US8238114B2Printed wiring board and method for manufacturing sameNIKI AYAO·Filed 2008·Granted Aug 7, 2012·13 cites·8 claims
- 0382US8085546B2Multilayer printed wiring board for semiconductor devices and method for manufacturing the boardNIKI AYAO·Filed 2010·Granted Dec 27, 2011·5 cites·9 claims
- 0477US8237056B2Printed wiring board having a stiffenerNIKI AYAO·Filed 2009·Granted Aug 7, 2012·5 cites·20 claims
- 0564US8826530B2Method for manufacturing substrate with metal filmNIKI AYAO·Filed 2010·Granted Sep 9, 2014·2 cites·21 claims
- 0664US8624121B2Multilayer printed wiring board for semiconductor devices and method for manufacturing the boardNIKI AYAO·Filed 2011·Granted Jan 7, 2014·1 cites·16 claims
- 0759US8563873B2Substrate with metal film and method for manufacturing the sameNIKI AYAO·Filed 2009·Granted Oct 22, 2013·1 cites·20 claims
- 0854US9060459B2Printed wiring board and method for manufacturing sameNIKI AYAO·Filed 2012·Granted Jun 16, 2015·0 cites·20 claims
- 0947US2011302779A1Printed wiring board and method for manufacturing sameNIKI AYAO·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →