Assignee
NUVOTRONICS LLC
US·27 granted patents·2 pending applications·1,114 citations·filing 2006–2015
Top patents by PatentIndex Score
29 records- 0198US7948335B2Coaxial waveguide microstructure having conductive and insulation materials defining voids thereinNUVOTRONICS LLC·Filed 2008·Granted May 24, 2011·62 cites·14 claims
- 0298US7898356B2Coaxial transmission line microstructures and methods of formation thereofNUVOTRONICS LLC·Filed 2008·Granted Mar 1, 2011·92 cites·11 claims
- 0398US7781727B2Optoelectronic component comprising an encapsulantNUVOTRONICS LLC·Filed 2008·Granted Aug 24, 2010·479 cites·10 claims
- 0498US7508065B2Device package and methods for the fabrication and testing thereofNUVOTRONICS LLC·Filed 2006·Granted Mar 24, 2009·71 cites·18 claims
- 0598US7449784B2Device package and methods for the fabrication and testing thereofNUVOTRONICS LLC·Filed 2006·Granted Nov 11, 2008·64 cites·2 claims
- 0697US9065163B1High frequency power combiner/dividerNUVOTRONICS LLC·Filed 2012·Granted Jun 23, 2015·116 cites·17 claims
- 0797US9000863B2Coaxial transmission line microstructure with a portion of increased transverse dimension and method of formation thereofNUVOTRONICS LLC·Filed 2013·Granted Apr 7, 2015·22 cites·11 claims
- 0897US8031037B2Three-dimensional microstructures and methods of formation thereofNUVOTRONICS LLC·Filed 2009·Granted Oct 4, 2011·46 cites·23 claims
- 0995US9583856B2Batch fabricated microconnectorsNUVOTRONICS LLC·Filed 2014·Granted Feb 28, 2017·17 cites·8 claims
- 1095US9410799B2Device package and methods for the fabrication and testing thereofNUVOTRONICS LLC·Filed 2015·Granted Aug 9, 2016·8 cites·7 claims
- 1195US9306254B1Substrate-free mechanical interconnection of electronic sub-systems using a spring configurationNUVOTRONICS LLC·Filed 2014·Granted Apr 5, 2016·33 cites·13 claims
- 1294US9505613B2Devices and methods for solder flow control in three-dimensional microstructuresNUVOTRONICS LLC·Filed 2014·Granted Nov 29, 2016·13 cites·23 claims
- 1394US9312589B2Coaxial waveguide microstructure having center and outer conductors configured in a rectangular cross-sectionNUVOTRONICS LLC·Filed 2014·Granted Apr 12, 2016·8 cites·18 claims
- 1494US8993450B2Device package and methods for the fabrication and testing thereofNUVOTRONICS LLC·Filed 2014·Granted Mar 31, 2015·8 cites·21 claims
- 1593US9024417B2Integrated electronic components and methods of formation thereofNUVOTRONICS LLC·Filed 2013·Granted May 5, 2015·11 cites·32 claims
- 1692US7888793B2Device package and methods for the fabrication and testing thereofNUVOTRONICS LLC·Filed 2006·Granted Feb 15, 2011·14 cites·19 claims
- 1790US10002818B2Integrated electronic components and methods of formation thereofNUVOTRONICS LLC·Filed 2015·Granted Jun 19, 2018·5 cites·18 claims
- 1889US9306255B1Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each otherNUVOTRONICS LLC·Filed 2014·Granted Apr 5, 2016·7 cites·16 claims
- 1987US7597488B2Optical assemblyNUVOTRONICS LLC·Filed 2006·Granted Oct 6, 2009·14 cites·11 claims
- 2086US9570789B2Transition structure between a rectangular coaxial microstructure and a cylindrical coaxial cable using step changes in center conductors thereofNUVOTRONICS LLC·Filed 2015·Granted Feb 14, 2017·3 cites·9 claims
- 2185US10027030B2Dielectric-free metal-only dipole-coupled broadband radiating array aperture with wide field of viewNUVOTRONICS LLC·Filed 2014·Granted Jul 17, 2018·6 cites·7 claims
- 2285US9490517B2High frequency power combiner/dividerNUVOTRONICS LLC·Filed 2015·Granted Nov 8, 2016·6 cites·15 claims
- 2385US9413052B2Three-dimensional microstructuresNUVOTRONICS LLC·Filed 2015·Granted Aug 9, 2016·3 cites·14 claims
- 2484US9570787B2Hollow core coaxial cables and methods of making the sameNUVOTRONICS LLC·Filed 2015·Granted Feb 14, 2017·2 cites·20 claims
- 2578US9515364B1Three-dimensional microstructure having a first dielectric element and a second multi-layer metal element configured to define a non-solid volumeNUVOTRONICS LLC·Filed 2014·Granted Dec 6, 2016·2 cites·11 claims
- 2670US9136575B2Three-dimensional microstructuresNUVOTRONICS LLC·Filed 2014·Granted Sep 15, 2015·1 cites·15 claims
- 2762US9337152B2Formulation for packaging an electronic device and assemblies made therefromNUVOTRONICS LLC·Filed 2013·Granted May 10, 2016·1 cites·2 claims
- 2845US2015162663A1Metal-only dielectric-free broadband aperture-coupled patch arrayNUVOTRONICS LLC·Filed 2014·Application pending·0 cites
- 2945US2015327410A1Device package and methods for the fabrication thereofNUVOTRONICS LLC·Filed 2015·Application pending·0 cites
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