Assignee
OH TAC KEUN
KR·3 granted patents·1 pending application·45 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0196US8618656B2Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the sameOH TAC KEUN·Filed 2011·Granted Dec 31, 2013·34 cites·8 claims
- 0285US8198136B2Stacked semiconductor package electrically connecting semiconductor chips using outer surfaces thereof and method for manufacturing the sameOH TAC KEUN·Filed 2010·Granted Jun 12, 2012·8 cites·20 claims
- 0373US8624241B2Semiconductor chip, stack-type semiconductor packageOH TAC KEUN·Filed 2011·Granted Jan 7, 2014·3 cites·14 claims
- 0447US2013154074A1Semiconductor stack packages and methods of fabricating the sameOH TAC KEUN·Filed 2012·Application pending·0 cites
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