Assignee
OZGUZ VOLKAN
2 granted patents·1 pending application·20 citations·filing 2005–2010
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0180US7786562B2Stackable semiconductor chip layer comprising prefabricated trench interconnect viasOZGUZ VOLKAN·Filed 2005·Granted Aug 31, 2010·11 cites·34 claims
- 0276US7768113B2Stackable tier structure comprising prefabricated high density feedthroughOZGUZ VOLKAN·Filed 2006·Granted Aug 3, 2010·9 cites·24 claims
- 0341US2010291735A1Stackable semiconductor chip layer comprising prefabricated trench interconnect viasOZGUZ VOLKAN·Filed 2010·Application pending·0 cites
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