Assignee
PARK JAE-HWA
KR·8 granted patents·6 pending applications·78 citations·filing 2006–2015
Top patents by PatentIndex Score
14 records- 0194US9691684B2Integrated circuit device including through-silicon via structure and decoupling capacitor and method of manufacturing the samePARK JAE-HWA·Filed 2014·Granted Jun 27, 2017·21 cites·20 claims
- 0293US9379042B2Integrated circuit devices having through silicon via structures and methods of manufacturing the samePARK JAE-HWA·Filed 2014·Granted Jun 28, 2016·15 cites·19 claims
- 0393US9093042B2Transparent display apparatusPARK JAE HWA·Filed 2012·Granted Jul 28, 2015·12 cites·14 claims
- 0490US9214411B2Integrated circuit devices including a through-silicon via structure and methods of fabricating the samePARK JAE-HWA·Filed 2014·Granted Dec 15, 2015·12 cites·15 claims
- 0590US9142490B2Integrated circuit device having through-silicon-via structure and method of manufacturing the integrated circuit devicePARK JAE-HWA·Filed 2014·Granted Sep 22, 2015·11 cites·20 claims
- 0678US9001007B2Display panelsPARK JAE HWA·Filed 2011·Granted Apr 7, 2015·3 cites·17 claims
- 0777US8952878B2Display devicePARK JAE HWA·Filed 2012·Granted Feb 10, 2015·2 cites·63 claims
- 0873US9673133B2Semiconductor devices having through-electrodesPARK JAE-HWA·Filed 2015·Granted Jun 6, 2017·2 cites·20 claims
- 0950US2013075909A1Semiconductor device including metal-containing conductive line and method of manufacturing the samePARK JAE-HWA·Filed 2012·Application pending·0 cites
- 1049US2010120211A1Methods of manufacturing Semiconductor Devices Including PMOS and NMOS Transistors Having Different Gate StructuresPARK JAE-HWA·Filed 2009·Application pending·0 cites
- 1148US2012100708A1Methods of Forming Integrated Circuit Devices Having Anisotropically-Oxidized Nitride LayersPARK JAE-HWA·Filed 2011·Application pending·0 cites
- 1245US2015102395A1Semiconductor device including decoupling capacitor and method of forming the samePARK JAE-HWA·Filed 2014·Application pending·0 cites
- 1344US2008070405A1Methods of forming metal wiring layers for semiconductor devicesPARK JAE-HWA·Filed 2007·Application pending·0 cites
- 1440US2007105397A1Method for removing hydrogen gas from a chamberPARK JAE-HWA·Filed 2006·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →