Assignee
POINT ENGINEERING CO LTD
KR·102 granted patents·86 pending applications·63 citations·filing 2006–2025
Top patents by PatentIndex Score
188 records- 0197US11145788B2Micro LED transfer headPOINT ENGINEERING CO LTD·Filed 2020·Granted Oct 12, 2021·6 cites·10 claims
- 0296US11691387B2Laminated anodic aluminum oxide structure, guide plate of probe card using same, and probe card having samePOINT ENGINEERING CO LTD·Filed 2021·Granted Jul 4, 2023·2 cites·7 claims
- 0395US2026086117A1Electrically conductive contact pinPOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 0491US11696398B2Anodic aluminum oxide structure, probe head having same, and probe card having samePOINT ENGINEERING CO LTD·Filed 2021·Granted Jul 4, 2023·2 cites·6 claims
- 0589US11497126B2Multilayer wiring board and probe card including samePOINT ENGINEERING CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·9 claims
- 0689US10533253B2Fluid permeable anodic oxide film and fluid permeable body using anodic oxide filmPOINT ENGINEERING CO LTD·Filed 2016·Granted Jan 14, 2020·2 cites·9 claims
- 0788US11581210B2Micro LED transfer systemPOINT ENGINEERING CO LTD·Filed 2019·Granted Feb 14, 2023·4 cites·5 claims
- 0886US10634634B2Micro sensor package and manufacturing method of micro sensor packagePOINT ENGINEERING CO LTD·Filed 2017·Granted Apr 28, 2020·4 cites·13 claims
- 0986US9496470B2Chip package having a light shieldPOINT ENGINEERING CO LTD·Filed 2016·Granted Nov 15, 2016·2 cites·7 claims
- 1086US2026086116A1Electrically conductive contact pinPOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 1185US10886446B2Micro LED structure and method of manufacturing samePOINT ENGINEERING CO LTD·Filed 2019·Granted Jan 5, 2021·4 cites·1 claims
- 1282US10615064B2Transfer head for micro LEDPOINT ENGINEERING CO LTD·Filed 2019·Granted Apr 7, 2020·3 cites·4 claims
- 1382US2024052516A1Metal part for process chamber and method of forming thin film layer of metal part for process chamberPOINT ENGINEERING CO LTD·Filed 2023·Application pending·0 cites
- 1481US12151461B2Manufacturing method of anodic oxide film structure and anodic oxide film structurePOINT ENGINEERING CO LTD·Filed 2022·Granted Nov 26, 2024·0 cites·2 claims
- 1581US2026036605A1Electrically conductive contact pin and inspection apparatus comprising the samePOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 1680US12296378B2Method of manufacturing metal product and mold used thereforPOINT ENGINEERING CO LTD·Filed 2024·Granted May 13, 2025·0 cites·8 claims
- 1780US10015841B2Micro heater and micro sensor and manufacturing methods thereofPOINT ENGINEERING CO LTD·Filed 2015·Granted Jul 3, 2018·3 cites·18 claims
- 1880US9559268B2Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by methodPOINT ENGINEERING CO LTD·Filed 2015·Granted Jan 31, 2017·3 cites·4 claims
- 1979US12546818B2Guide plate and test device including samePOINT ENGINEERING CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·5 claims
- 2078US11217464B2System for transferring micro LEDPOINT ENGINEERING CO LTD·Filed 2019·Granted Jan 4, 2022·2 cites·18 claims
- 2178US2025357694A1Electrical connectorPOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 2277US10840115B2Micro LED transfer headPOINT ENGINEERING CO LTD·Filed 2019·Granted Nov 17, 2020·2 cites·3 claims
- 2377US9865787B2Chip substrate and chip package modulePOINT ENGINEERING CO LTD·Filed 2015·Granted Jan 9, 2018·2 cites·10 claims
- 2476US9768369B2LED metal substrate package and method of manufacturing samePOINT ENGINEERING CO LTD·Filed 2016·Granted Sep 19, 2017·2 cites·8 claims
- 2575US12517151B2Electrically conductive contact pin and manufacturing method thereforPOINT ENGINEERING CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·13 claims
- 2675US11651904B2Multilayer ceramic substrate and probe card including samePOINT ENGINEERING CO LTD·Filed 2022·Granted May 16, 2023·0 cites·5 claims
- 2775US10241094B2Micro heater, micro sensor and micro sensor manufacturing methodPOINT ENGINEERING CO LTD·Filed 2016·Granted Mar 26, 2019·2 cites·6 claims
- 2874US11535001B2Manufacturing method of anodic oxide film structure and anodic oxide film structurePOINT ENGINEERING CO LTD·Filed 2020·Granted Dec 27, 2022·0 cites·2 claims
- 2974US10872828B2Inspection and replacement method for micro LEDPOINT ENGINEERING CO LTD·Filed 2019·Granted Dec 22, 2020·1 cites·3 claims
- 3073US12546812B2Test device capable of testing micro LED and manufacturing method thereofPOINT ENGINEERING CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·10 claims
- 3173US2025306088A1Electrical connector and test device comprising the samePOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 3271US11337347B2System for transferring micro LEDPOINT ENGINEERING CO LTD·Filed 2019·Granted May 17, 2022·1 cites·12 claims
- 3371US10707394B2Micro LED structure and method of manufacturing samePOINT ENGINEERING CO LTD·Filed 2018·Granted Jul 7, 2020·1 cites·4 claims
- 3470US9559276B2LED metal substrate package and method of manufacturing samePOINT ENGINEERING CO LTD·Filed 2013·Granted Jan 31, 2017·2 cites·10 claims
- 3570US9374890B2Chip substrate having a lens insertPOINT ENGINEERING CO LTD·Filed 2014·Granted Jun 21, 2016·1 cites·7 claims
- 3670US2025264526A1Interposer and inspection apparatus comprising the samePOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 3769US10658549B2Unit substrate for optical device and optical device package having samePOINT ENGINEERING CO LTD·Filed 2018·Granted May 19, 2020·1 cites·10 claims
- 3869US2025258197A1Guide plate and pin block comprising the samePOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 3969US2021115584A1Metal part for process chamber and method for forming layer of metal part for process chamberPOINT ENGINEERING CO LTD·Filed 2020·Application pending·0 cites
- 4068US9281452B2Method for manufacturing a can package-type optical device, and optical device manufactured therebyPOINT ENGINEERING CO LTD·Filed 2012·Granted Mar 8, 2016·2 cites·6 claims
- 4168US9018651B2Optical device integrated with driving circuit and power supply circuit, method for manufacturing optical device substrate used therein, and substrate thereofPOINT ENGINEERING CO LTD·Filed 2012·Granted Apr 28, 2015·2 cites·11 claims
- 4267US12270828B2Probe cardPOINT ENGINEERING CO LTD·Filed 2021·Granted Apr 8, 2025·0 cites·3 claims
- 4367US11545596B2Optical component package and device using samePOINT ENGINEERING CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·7 claims
- 4467US11437196B2Multilayer ceramic substrate and probe card including samePOINT ENGINEERING CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·6 claims
- 4567US2025341542A1Electrical connectorPOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 4666US11361575B2Electronic device using piezoelectric material and manufacturing method thereofPOINT ENGINEERING CO LTD·Filed 2019·Granted Jun 14, 2022·0 cites·11 claims
- 4765US12169212B2Probe head and probe card comprising samePOINT ENGINEERING CO LTD·Filed 2021·Granted Dec 17, 2024·0 cites·4 claims
- 4865US2024222418A1Vertically stacked electronic device and method for manufacturing samePOINT ENGINEERING CO LTD·Filed 2023·Application pending·0 cites
- 4964US11061070B2Guide plate for probe card and manufacturing method thereof, and probe card having samePOINT ENGINEERING CO LTD·Filed 2019·Granted Jul 13, 2021·0 cites·9 claims
- 5064US10964871B2Micro LED structure and method of manufacturing samePOINT ENGINEERING CO LTD·Filed 2020·Granted Mar 30, 2021·0 cites·2 claims
Showing the top 50 of 188 patent records by PatentIndex Score.
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