Vertically stacked electronic device and method for manufacturing same

Abstract

Proposed is a vertically stacked electronic device that enables the implementation of high-resolution displays by stacking individual LEDs vertically, and a method for manufacturing the vertically stacked electronic device.

What is claimed is: 
     
         1 . A vertically stacked electronic device formed by stacking a plurality of micro-LEDs in a vertical direction, the electronic device comprising:
 a substrate;   a first micro-LED located on the substrate;   a second micro-LED located on the first micro-LED;   a third micro-LED located on the second micro-LED;   a common electrode provided through the third micro-LED, the second micro-LED, and the first micro-LED;   a first electrode that penetrates the electronic device and is electrically connected to the first micro-LED;   a second electrode that penetrates the electronic device and is electrically connected to the second micro-LED; and   a third electrode that penetrates the electronic device and is electrically connected to the third micro-LED.   
     
     
         2 . A method for manufacturing a vertically stacked electronic device including a plurality of micro-LEDs, the method comprising:
 providing an LED stack including the plurality of micro-LEDs;   providing a pad electrode in a penetration region formed by etching the LED stack;   providing a protective film on surfaces of the LED stack and the pad electrode;   selectively removing the protective film provided on the surface of the pad electrode; and   providing a bonding electrode in the penetration region.   
     
     
         3 . The method of  claim 2 , wherein in the selectively removing the protective film, the protective film, where the pad electrode is located, is selectively irradiated with a laser.