Assignee
POINT ENGINEERING CO LTD
KR·102 granted patents·86 pending applications·63 citations·filing 2006–2025
Top patents by PatentIndex Score
188 records- 0197US11145788B2Micro LED transfer headPOINT ENGINEERING CO LTD·Filed 2020·Granted Oct 12, 2021·6 cites·10 claims
- 0296US11691387B2Laminated anodic aluminum oxide structure, guide plate of probe card using same, and probe card having samePOINT ENGINEERING CO LTD·Filed 2021·Granted Jul 4, 2023·2 cites·7 claims
- 0395US2026086117A1Electrically conductive contact pinPOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 0491US11696398B2Anodic aluminum oxide structure, probe head having same, and probe card having samePOINT ENGINEERING CO LTD·Filed 2021·Granted Jul 4, 2023·2 cites·6 claims
- 0589US11497126B2Multilayer wiring board and probe card including samePOINT ENGINEERING CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·9 claims
- 0689US10533253B2Fluid permeable anodic oxide film and fluid permeable body using anodic oxide filmPOINT ENGINEERING CO LTD·Filed 2016·Granted Jan 14, 2020·2 cites·9 claims
- 0788US11581210B2Micro LED transfer systemPOINT ENGINEERING CO LTD·Filed 2019·Granted Feb 14, 2023·4 cites·5 claims
- 0886US10634634B2Micro sensor package and manufacturing method of micro sensor packagePOINT ENGINEERING CO LTD·Filed 2017·Granted Apr 28, 2020·4 cites·13 claims
- 0986US9496470B2Chip package having a light shieldPOINT ENGINEERING CO LTD·Filed 2016·Granted Nov 15, 2016·2 cites·7 claims
- 1086US2026086116A1Electrically conductive contact pinPOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 1185US10886446B2Micro LED structure and method of manufacturing samePOINT ENGINEERING CO LTD·Filed 2019·Granted Jan 5, 2021·4 cites·1 claims
- 1282US10615064B2Transfer head for micro LEDPOINT ENGINEERING CO LTD·Filed 2019·Granted Apr 7, 2020·3 cites·4 claims
- 1382US2024052516A1Metal part for process chamber and method of forming thin film layer of metal part for process chamberPOINT ENGINEERING CO LTD·Filed 2023·Application pending·0 cites
- 1481US12151461B2Manufacturing method of anodic oxide film structure and anodic oxide film structurePOINT ENGINEERING CO LTD·Filed 2022·Granted Nov 26, 2024·0 cites·2 claims
- 1581US2026036605A1Electrically conductive contact pin and inspection apparatus comprising the samePOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 1680US12296378B2Method of manufacturing metal product and mold used thereforPOINT ENGINEERING CO LTD·Filed 2024·Granted May 13, 2025·0 cites·8 claims
- 1780US10015841B2Micro heater and micro sensor and manufacturing methods thereofPOINT ENGINEERING CO LTD·Filed 2015·Granted Jul 3, 2018·3 cites·18 claims
- 1880US9559268B2Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by methodPOINT ENGINEERING CO LTD·Filed 2015·Granted Jan 31, 2017·3 cites·4 claims
- 1979US12546818B2Guide plate and test device including samePOINT ENGINEERING CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·5 claims
- 2078US11217464B2System for transferring micro LEDPOINT ENGINEERING CO LTD·Filed 2019·Granted Jan 4, 2022·2 cites·18 claims
- 2178US2025357694A1Electrical connectorPOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 2277US10840115B2Micro LED transfer headPOINT ENGINEERING CO LTD·Filed 2019·Granted Nov 17, 2020·2 cites·3 claims
- 2377US9865787B2Chip substrate and chip package modulePOINT ENGINEERING CO LTD·Filed 2015·Granted Jan 9, 2018·2 cites·10 claims
- 2476US9768369B2LED metal substrate package and method of manufacturing samePOINT ENGINEERING CO LTD·Filed 2016·Granted Sep 19, 2017·2 cites·8 claims
- 2575US12517151B2Electrically conductive contact pin and manufacturing method thereforPOINT ENGINEERING CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·13 claims
- 2675US11651904B2Multilayer ceramic substrate and probe card including samePOINT ENGINEERING CO LTD·Filed 2022·Granted May 16, 2023·0 cites·5 claims
- 2775US10241094B2Micro heater, micro sensor and micro sensor manufacturing methodPOINT ENGINEERING CO LTD·Filed 2016·Granted Mar 26, 2019·2 cites·6 claims
- 2874US11535001B2Manufacturing method of anodic oxide film structure and anodic oxide film structurePOINT ENGINEERING CO LTD·Filed 2020·Granted Dec 27, 2022·0 cites·2 claims
- 2974US10872828B2Inspection and replacement method for micro LEDPOINT ENGINEERING CO LTD·Filed 2019·Granted Dec 22, 2020·1 cites·3 claims
- 3073US12546812B2Test device capable of testing micro LED and manufacturing method thereofPOINT ENGINEERING CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·10 claims
- 3173US2025306088A1Electrical connector and test device comprising the samePOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 3271US11337347B2System for transferring micro LEDPOINT ENGINEERING CO LTD·Filed 2019·Granted May 17, 2022·1 cites·12 claims
- 3371US10707394B2Micro LED structure and method of manufacturing samePOINT ENGINEERING CO LTD·Filed 2018·Granted Jul 7, 2020·1 cites·4 claims
- 3470US9559276B2LED metal substrate package and method of manufacturing samePOINT ENGINEERING CO LTD·Filed 2013·Granted Jan 31, 2017·2 cites·10 claims
- 3570US9374890B2Chip substrate having a lens insertPOINT ENGINEERING CO LTD·Filed 2014·Granted Jun 21, 2016·1 cites·7 claims
- 3670US2025264526A1Interposer and inspection apparatus comprising the samePOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 3769US10658549B2Unit substrate for optical device and optical device package having samePOINT ENGINEERING CO LTD·Filed 2018·Granted May 19, 2020·1 cites·10 claims
- 3869US2025258197A1Guide plate and pin block comprising the samePOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 3969US2021115584A1Metal part for process chamber and method for forming layer of metal part for process chamberPOINT ENGINEERING CO LTD·Filed 2020·Application pending·0 cites
- 4068US9281452B2Method for manufacturing a can package-type optical device, and optical device manufactured therebyPOINT ENGINEERING CO LTD·Filed 2012·Granted Mar 8, 2016·2 cites·6 claims
- 4168US9018651B2Optical device integrated with driving circuit and power supply circuit, method for manufacturing optical device substrate used therein, and substrate thereofPOINT ENGINEERING CO LTD·Filed 2012·Granted Apr 28, 2015·2 cites·11 claims
- 4267US12270828B2Probe cardPOINT ENGINEERING CO LTD·Filed 2021·Granted Apr 8, 2025·0 cites·3 claims
- 4367US11545596B2Optical component package and device using samePOINT ENGINEERING CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·7 claims
- 4467US11437196B2Multilayer ceramic substrate and probe card including samePOINT ENGINEERING CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·6 claims
- 4567US2025341542A1Electrical connectorPOINT ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 4666US11361575B2Electronic device using piezoelectric material and manufacturing method thereofPOINT ENGINEERING CO LTD·Filed 2019·Granted Jun 14, 2022·0 cites·11 claims
- 4765US12169212B2Probe head and probe card comprising samePOINT ENGINEERING CO LTD·Filed 2021·Granted Dec 17, 2024·0 cites·4 claims
- 4865US2024222418A1Vertically stacked electronic device and method for manufacturing samePOINT ENGINEERING CO LTD·Filed 2023·Application pending·0 cites
- 4964US11061070B2Guide plate for probe card and manufacturing method thereof, and probe card having samePOINT ENGINEERING CO LTD·Filed 2019·Granted Jul 13, 2021·0 cites·9 claims
- 5064US10964871B2Micro LED structure and method of manufacturing samePOINT ENGINEERING CO LTD·Filed 2020·Granted Mar 30, 2021·0 cites·2 claims
Showing the top 50 of 188 patent records by PatentIndex Score.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →