Assignee
RHYNER KENNETH R
US·1 granted patent·1 pending application·7 citations·filing 2011–2012
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0177US8674505B2Integrated circuit packaging with ball grid array having differential pitch to enhance thermal performanceRHYNER KENNETH R·Filed 2012·Granted Mar 18, 2014·7 cites·16 claims
- 0240US2012013003A1Bga package with traces for plating pads under the chipRHYNER KENNETH R·Filed 2011·Application pending·0 cites
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