Assignee
ROY MIHIR K
US·5 granted patents·2 pending applications·25 citations·filing 2006–2014
Top patents by PatentIndex Score
7 records- 0186US8552564B2Hybrid-core through holes and viasROY MIHIR K·Filed 2010·Granted Oct 8, 2013·7 cites·23 claims
- 0285US8952540B2In situ-built pin-grid arrays for coreless substrates, and methods of making sameROY MIHIR K·Filed 2011·Granted Feb 10, 2015·7 cites·24 claims
- 0383US8278214B2Through mold via polymer block packageROY MIHIR K·Filed 2009·Granted Oct 2, 2012·10 cites·8 claims
- 0468US9622350B2Method of forming a circuit boardROY MIHIR K·Filed 2013·Granted Apr 11, 2017·1 cites·12 claims
- 0559US2015035144A1High density interconnect device and methodROY MIHIR K·Filed 2014·Application pending·0 cites
- 0651US8450857B2Through mold via polymer block packageROY MIHIR K·Filed 2012·Granted May 28, 2013·0 cites·7 claims
- 0743US2008145622A1Polymer-based integrated thin film capacitors, packages containing same and methods related theretoROY MIHIR K·Filed 2006·Application pending·0 cites
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